Job Description
The Principal Process Integration Engineer is responsible for ensuring the quality, reliability, and yield of InP-based Photonic Integrated Circuit (PIC) products. This role plays a key part in ramping high-volume production and works cross-functionally to troubleshoot and optimize wafer fabrication processes, resolve yield issues, and support next-generation PIC platform development.
Responsibilities
• Own wafer quality and yield using deep knowledge of fab processes, device physics, and test/reliability data
• Analyze process deviations and test failures to identify root causes and implement corrective actions
• Establish, maintain, and monitor inline fab process specifications and capability (CPK)
• Drive yield improvement initiatives from concept through qualification and production release
• Define design rules and develop test structures for effective process control
• Support technology development, transfer, and manufacturing ramp for next-generation PIC platforms
• Partner with Process Engineering to improve process stability and capability
• Collaborate with Operations to improve throughput and reduce cycle time
Qualifications
• MS or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemical Engineering, or a related field
• 10+ years of experience in semiconductor wafer fabrication
• Hands-on experience with III-V processes, including epitaxy, wet and dry etching, photolithography, and metal deposition
• Strong understanding of semiconductor processes and device physics
• Proven analytical and problem-solving skills with proficiency in data analysis tools (e.g., JMP, Python)
• Experience with SPC, DOE, and yield optimization methodologies
• Excellent communication skills with the ability to present technical work to diverse stakeholders
