Summary of Role:
GlobalFoundries (GF) seeks a hands-on Assembly Integration Design Engineer that will deliver industry leading electro-optical transceivers using GF’s Photonix platform and advanced packaging 2.5D and 3D co-packaged optics form factors. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design, with a focus on product and module performance, reliability, packaging design rules, materials selection criteria, and definition of electrical, photonic and thermal requirements for chiplet and product modules.
Essential Responsibilities:
- Drive SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
- Support new customer products with innovative design solutions and technology design rules.
- Drive design reviews with cross functional teams
- Drive cross functional teams to resolve technical & yield concerns
- Develop engineering team skills in packaging design constraints and considerations
- Develop complex analysis models to predict manufacturability, cost, and quality.
- Protect the business by ensuring that all necessary requirements are met and that the technology meets the expectations of customers and markets to avoid costly re-designs.
- Foster discipline and qualification robustness through a consistent global design process
- Drive CIP (Continuous improvement plans) to deliver organizational goals.
Other Responsibilities:
- Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
- Travel <10% to other GlobalFoundries facilities may be necessary
Required Qualifications:
- PhD, or MS + 2 or more years of experience
- Experience in bringing packaged products from development into production.
- Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.
- Advanced packaging design and layout expertise
- Strong written and spoken English communication skills
Preferred Qualifications:
- Materials science, thermal, mechanical, simulation background.
- Experience with failure analysis, design of experiments, & packaging process integration.
- Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
- Expertise in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
- Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.
Expected Salary Range
$85,000.00 - $146,000.00
The exact Salary will be determined based on qualifications, experience and location.
