SRI International

Principal Image Sensor Development Engineer

SRI International$133K — $200K *
Aerospace & Defense
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's in Optics, Physics, Electrical Engineering or related; PhD preferred.
  • 15+ years of experience in CMOS image sensor design (Defense, Commercial).
  • US Citizenship required; ability to obtain/maintain a security clearance.
  • Proficient with Cadence Design Systems IC design tools for CMOS/CCD.
  • Skilled in TCAD process simulation tools or optics/optoelectronics.
  • In-depth knowledge and process integration experience with advanced imaging technologies preferred.
  • Understanding of circuit layouts and schematics, capable of running DRC and LVS.

Responsibilities

  • Define pixel architecture, design layout, and integration schemes.
  • Design and layout pixel test structures for validation.
  • Generate and evaluate process experiments for optimizing imager performance.
  • Collaborate with engineers in optimization of pixel designs and processes.
  • Manage and support foundry-level fabrication processes for sensors.
  • Design and simulate advanced CMOS, CCD, and Lidar image sensors.
  • Develop next-gen imaging architectures in collaboration with mixed signal and digital design teams.
  • Lead new product introduction projects for internal and external customers.

Benefits

  • Comprehensive benefits package including health, retirement, and professional development opportunities.
  • Opportunities for funded R&D and product design programs.
  • Access to SRI's Pay for Outstanding Performance program and annual Performance Based Compensation program.
Full Job Description
Overview

InSyS's Center for Advanced Imaging (CAI) is searching for a Principal CMOS/CCD image Sensor Development Engineer to help expand the Low Light CMOS Cameras and Space Qualified Sensors thrusts. CAI has four focused thrust areas providing innovative low light imaging, space qualified imaging, lidar imaging, and commercial OEM products. The candidate will be expected to support or lead technical and marketing activities for the domestic and international customer set and prime contractors doing government business. The role's objective is to position SRI for continued growth in monolithic CMOS, CCD, III-V and ROIC-based imaging technologies and products deployed in the commercial, government and military markets.

 

This position will work onsite in either our Princeton, NJ or Rochester, NY office.

Responsibilities
  • Define the pixel architecture, layout/design, and corresponding process integration schemes.
  • Design & layout of pixel test structures that will be required for pixel & process validation.
  • Generate and evaluate process experiments for the optimization of Imager performance, quality, and manufacturability.
  • Work independently and also with other engineers in design, probe, characterization, and production to optimize pixel design & process
  • Manage/support foundry level fabrication process of CMOS and CCD image sensor
  • Design and perform simulations of advanced CMOS, CCD and Lidar image sensors
  • Work with mixed signal and digital design team to develop innovative next generation imaging architectures and technology platforms.
  • Lead/support the new product introduction (NPI) projects and the programs in CMOS and CCD image sensors for internal/external customers
  • Work closely with BD and engineering leadership to design/develop Imager technology to support the technology/product roadmap
  • Develop and win externally and internally funded research, development, and product design programs.
  • Lead/participate in the development of technical proposals in support of new business
Qualifications
  • Bachelors or Masters in Optics, Physics, Electrical Engineering or a related field required, PhD desirable.
  • 15+ years’ experience in CMOS image sensor design (Defense, Commercial).
  • Due to US Government requirements this position requires US Citizenship and the ability to obtain/maintain a security clearance.
  • Proficiency with Cadence Design Systems IC design tools (layout, LVS, DRC, Schematic) in CMOS/CCD image sensor.
  • Proficiency on TCAD process simulation tools or optics/optoelectronics.
  • In depth knowledge and process integration experience in the state-of-art CMOS/CCD image senor is preferred. (i.e. Backside illuminated Senor, Global shutter, 3d Wafer stacking)
  • Ability to understand as well as create circuit layouts and schematics and run DRC and LVS.
  • Knowledge on how to build topological and electrical design rules understanding limitations of fab tools is plus.
  • Ability to travel up to 10% of the time if necessary.

The salary range is: $133,520-$200,0000. Salary ranges will vary and are based on several factors, including geographic location, market competitiveness and equity amongst internal employees in similar roles. Positions may also qualify for SRI's Pay for Outstanding Performance program or the annual Performance Based Compensation program. SRI also has a competitive benefits package, to view details please go to https://www.sri.com/resources/benefits/. SRI will accept applications until the position is filled.

 

About SRI International

SRI International is an independent, nonprofit research center that works with clients to take the most advanced R&D from the laboratory to the marketplace. Serving government and industry, SRI discovers and delivers solutions for a wide range of scientific and technological challenges. The company's innovations have created new industries and products that have changed the world. SRI is headquartered in Menlo Park, California, and has additional offices and facilities around the world.
Learn more about SRI International
Size
2,000 employees
Industry
Founded
1946

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