Principal Analog Mixed - Signal Design Engineer

Veracity Solutions

$130K — $180K *
Telecommunications & Hardware
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering with 10-15 years or MSc/PhD with 5+ years of experience in RF/Analog design
  • Proven experience in IC design including chip tape-out and lab evaluation of receivers
  • Solid experience with EDA CAD tools and performing Analog Custom Layout
  • Measuring IC performance and debugging design to correlate simulations with measurements
  • Deep understanding of detailed transistor level design, device physics, and control/feedback loop stability analysis

Responsibilities

  • Lead circuit design and provide technical leadership
  • Design cutting-edge transimpedance amplifiers in SiGe BiCMOS technology
  • Develop transmission line structures for enhanced millimeter-wave performance
  • Create high-performance broadband analog circuits for optical front-end receivers
  • Guide team in implementing major circuit block microarchitectures and technologies
  • Facilitate post-silicon validation and transition to mass production
  • Collaborate with cross-functional teams for customer support and qualification

Benefits

  • Hybrid work schedule with 2.5 days a week minimum in-office requirement
Full Job Description
Principal Analog Mixed-Signal Design Engineer - RF / SiPho / TIA / CMOS / SiGe

Hybrid - 2.5 days a week minimum in office

Westlake Village, CA, US

Seeking an RF and Analog Design Engineer to contribute to the development of multi-tens of GHz Transimpedance amplifiers TIAs. These optical interface chips are tightly coupled with our high-performance equalizers. The results of our innovative designs have made our TIAs best in class for coherent long-haul and metro systems as well as PAM4 data center systems.

In this role you will be responsible for:
• ctive circuit design as well as technical leadership.
• Design leading edge transimpedance amplifier design, primarily in Silicon Germanium (SiGe) BiCMOS (Bipolar Complementary Metal Oxide Semiconductor) technology, where circuit performance will need to transcend beyond industry leading products.
• Develop transmission line structures and other millimeter wave structures to enable higher performance than would normally be achievable.
• Design of hi-performance broadband analog circuits for optical front-end receivers.
• Design of various other analog circuits including linear regulators, AGC loop, current/voltage sensors, bandgaps etc.
• Develop microarchitecture of major circuit blocks and guide team of designers to implement them. Work with various technologies including SiGe BiCMOS and CMOS.
• Work with other functional groups to facilitate post-silicon validation, qualification, transition to mass production, and customer support.

What We're Looking For

Bachelor's degree in Electrical Engineering in the areas of design of high-performance RF/Analog Receiver/TIA design and 10 - 15 years' experience Or MSc EE Or PhD EE with 5+ years of experience in the areas of design of high-performance RF/Analog Receiver/TIA design.
• Proven experience in IC design including chip tape-out AND lab evaluation of receiver design working in the industry).
• Solid experience in.

o Using EDA CAD tools

o Performing Analog Custom Layout
• Experience in measuring IC performance and debug of design to correlate simulations to measurements
• Deep understanding of fundamentals, including:

o Detailed transistor level design

o Device physics

o Control/Feedback loop stability analysis
• Direct project experience in at least one of the following areas is a plus:

o GC loop design

o High precision analog circuits (Including linear regulators, current sensors, bandgaps and DAC/Client)

o Experience in CTLE design
• Experience in Package-System integration issues desired
• Project experience in using different technologies. (SiGe BiCMOS is a plus)
• team-player
• Experience in the following is a strong plus:

o Overseeing and mentoring junior circuit designers

o Experience as chip lead with success in silicon

o Experience in taking chips to mass production

o bility to translate chip level specifications into architecture
• Strong communication, presentation and documentation skills.

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