Qualifications

• BSME/MSME degree in Mechanical Engineering or relevant field with 12+ years in semiconductor packaging.
• Experience in microelectronic assembly design for defense, avionics, aerospace, or automotive sectors.
• Proficiency in micro-fluidics related to electronics packaging.
• Expert skill in SolidWorks or similar CAD tools.
• In-depth knowledge of microelectronic package technologies, manufacturing methods, and materials.
• Experience with various assembly processes such as die attach, wire bond, and solder reflow.
• Familiarity with microelectronic inspection tools and reliability calculation methods.

Responsibilities

• Lead mechanical design and analysis for electronics packaging in defense applications.
• Collaborate with IC and module designers, process engineers, and CAD specialists to innovate packaging technology.
• Use industry-standard design tools to create electronic package designs for R&D and production.
• Generate intellectual property focused on thermal performance and high-frequency operations.
• Research emerging materials for future microelectronics packaging innovations.
• Guide design decisions to ensure performance specifications and yield requirements are met.
• Oversee manufacturing issues and adjust designs as necessary.

Benefits

• Work in a cutting-edge technology environment within the defense and aerospace sectors.
• Collaborate with a highly skilled cross-functional team.
• Opportunity to influence next-generation packaging technologies.
• Engage with emerging materials and advanced microelectronic packaging challenges.