Master's degree plus 20 years or PhD plus 15 years of experience
Proven track record of transitioning packaged products from development to production
Proficiency in HFSS, Zmax, Flotherm, or similar design modeling tools
Expertise in advanced packaging design and layout
Strong written and verbal English communication skills
Responsibilities
Drive innovations in SiPh advanced packaging and develop design enablement for customers
Support customers with innovative design solutions and technology rules
Lead design reviews with cross-functional teams
Resolve technical and yield issues with multidisciplinary teams
Enhance engineers' knowledge of packaging design constraints
Develop complex analysis models for manufacturability, cost, and quality predictions
Ensure all technology requirements and performance standards align with customer expectations to avoid re-designs
Implement consistent global design processes that promote robustness and discipline
Initiate Continuous Improvement Plans to achieve organizational goals
Conduct all tasks in compliance with environmental and safety standards
Benefits
Comprehensive health and wellness programs
Opportunity for career advancement through skill development
Access to cutting-edge technology and tools
Supportive team environment that encourages collaboration and innovation
Participation in continuous improvement initiatives
Full Job Description
Summary of Role:
As a Photonic Packaging Design Integration Engineer within GF's APPC, you will lead the development and sustainment of advanced optical packaging solutions for silicon photonics (SiPh) and co-packaged optics (CPO) platforms. You will collaborate across photonics, electrical, mechanical, and manufacturing teams to deliver scalable, low-loss, and cost-effective packaging architectures that meet stringent performance and reliability targets. The candidate will bring a strong focus on thermal, mechanical, electrical, and optical chip package co-design. Focus on product and module performance, reliability, packaging design rules, materials selection criteria, definition of electrical, photonic and thermal definition for chiplet and product modules as well as reliability qualification approaches.
Essential Responsibilities:
Drives SiPh advanced packaging product innovations, design enablement for customers, and efficient manufacturing processes internally and with OSAT ecosystems.
Support new customer products with innovative design solutions and technology design rules.
Drives design reviews with cross functional teams
Drives cross function teams to resolve technical & yield concerns
Develops engineers skills in packaging design constraints and considerations
Develops complex analysis models to predict for manufacturability, cost, and quality.
Protects the business by ensuring that all necessary requirements are met and that the technology performs to the expectations of customers and market to avoid costly re-designs.
Drives discipline and qualification robustness through a consistent global design processes
Drive CIP (Continuous improvement plans) to deliver organizational goals.
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs
Other Responsibilities:
Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
Required Qualifications:
MS +20, or PhD + 15 or more years of experience
Experience in bringing packaged products from development into production.
Experience with HFSS, Zmax, Flotherm, or other design and modeling tools.
Advanced packaging design and layout expertise
Strong written and spoken English communication skills
Experience with failure analysis, design of experiments, & packaging process integration.
Validated record of photonic and electrical interconnect innovation and product release internally or with an OSAT ecosystem.
Expert in chip package interaction for 2D, 2.5D, 3D, 3.5D SiPh advanced packaging.
Experiment
Broad and deep knowledge of global technology and commercial trends related to current technology, design, or manufacturing, with growth into trends related to future technologies, design, or manufacturing.
Expected Salary Range $131,900.00 - $241,500.00
The exact Salary will be determined based on qualifications, experience and location.
