Job Description:We are seeking an experienced Physical Failure Analysis Engineer II with 2-5 years of hands-on experience to support semiconductor failure analysis. The ideal candidate will have deep expertise operating a Dual Beam Focused Ion Beam / Scanning Electron Microscope (FIB/SEM) and strong skills in sample preparation techniques to enable accurate root-cause analysis. This role will work closely with failure analysis engineers to analyze physical defects, packaging issues, and structural failures across a variety of device technologies.
Requirements/Qualifications:Key Responsibilities
- Operate and maintain Dual Beam FIB/SEM systems for:
- Site-specific cross-sectioning
- Circuit editing
- TEM lamella preparation
- Defect localization and characterization
- Perform package decapsulation using chemical, mechanical, laser, and plasma-based techniques.
- Execute precision CNC milling for sample exposure and preparation.
- Conduct X-ray analysis (2D/3D) for non-destructive internal inspection.
- Perform C-SAM (Scanning Acoustic Microscopy) for delamination, void, and crack detection.
- Apply additional sample preparation techniques including:
- Mechanical polishing
- ion milling
- Chemical etching
- Plasma cleaning
- Document analysis procedures, findings, and results in detailed technical reports.
- Collaborate with engineering teams to support root cause analysis and corrective action development.
- Maintain lab equipment, follow EHS protocols, and support continuous improvement of FA processes.
Required Qualifications
- 2-5 years of experience in physical failure analysis or related semiconductor/electronics lab environment.
- Expert-level proficiency with Dual Beam FIB/SEM systems
- Strong understanding of semiconductor device structures and electronic packaging.
- Ability to interpret SEM images, cross-sections, and failure signatures.
- Experience with technical documentation and report writing.
Requirements/Qualifications:- Bachelor's or Master's degree in Chemistry, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, or a related technical field.
- Experience with advanced packaging (BGA, QFN, CSP, flip-chip, wafer-level packaging).
- Familiarity with TEM sample preparation and coordination with TEM analysis.
- Hands-on experience with:
- Package decapsulation
- CNC milling
- X-ray inspection
- C-SAM analysis
Work Environment
- Laboratory-based role requiring use of advanced analytical equipment
- May involve handling chemicals and operating precision machinery
- Compliance with EHS standards is required
Travel Time:0% - 25%
Physical Attributes:Handling, Hearing, Other, Seeing, Talking, Works Alone, Works Around Others
Physical Requirements:100% inside, normal business hours
