NXP Semiconductors

Photolithography Process Engineer

NXP Semiconductors$90K — $120K *
Manufacturing & Automotive
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • BS or MS degree in engineering or a relevant field
  • Over 5 years of experience in process engineering within high-volume semiconductor manufacturing
  • Familiarity with Six-Sigma statistical methodology
  • Experience with ASML Scanner, Canon Stepper, TEL ACT 8, Mark 7 track, KLA 8100 CDSEM or Archers is a plus

Responsibilities

  • Reduce costs associated with wafer scrap and photo rework
  • Develop and document Out of Control Action Plan procedures
  • Implement process SPC using Six-Sigma
  • Optimize processes through Six-Sigma methodologies
  • Enhance tool utilization and availability
  • Collaborate with manufacturing and industrial engineering on capacity planning
  • Lead and participate in cross-functional lean activity teams

Benefits

  • Opportunities for professional development and training
  • Collaborative work environment with cross-functional teams
  • Access to advanced semiconductor technology and equipment
  • Participation in process improvement initiatives through Six-Sigma and lean methodologies
Full Job Description
Job Summary:

Photolithography Process Engineer in a high-volume semiconductor wafer manufacturing environment. Prior experience with semiconductor manufacturing process is required. Previous experience with ASML Scanner, Canon Stepper, TEL ACT 8 or Mark 7 track, KLA 8100 CDSEM or Archers is highly desirable.

Key Challenges:
  • Reducing overall cost of non-conformal like wafer scrap, and photo rework
  • Developing and writing standard work procedure document for Out of Control Action Plan
  • Implementation of process SPC using Six-Sigma statistical methodology
  • Process development and optimization utilizing Six-Sigma methodology
  • Improving tool utilization and availability
  • Working with manufacturing and industrial engineering for capacity planning and modeling
  • Participating in and/or leading cross-functional and lean activity teams
  • Supporting process development activities
  • Sourcing and process releasing new equipment
  • Training process technician in dispositioning of wafer in process out of control situations
  • Training wafer FAB associate in process tool operation using our standard work process


Cross functional aspects:
  • Working closely with Photo equipment team to identify and reduce source of process variation and implementing zero defect process
  • Collaborate with device team to improve process integration margin


Job Qualifications:
  • Must have a BS or MS degree in engineering or a degree in relevant field of studies
  • More than 5 years of process engineering experience in a similar high volume semiconductor manufacturing environment is preferred
  • Six-Sigma statistical methodology

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About NXP Semiconductors

NXP Semiconductors N.V. is a Dutch semiconductor manufacturer with headquarters in Eindhoven, Netherlands. The company employs approximately 31,000 people in more than 35 countries, including 11,200 engineers in 33 countries. NXP reported revenue of $8.88 billion in 2020. The company's products are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. NXP is the co-inventor of near field communication (NFC) technology along with Sony and supplies NFC chip sets that enable mobile payments, as well as secure access to cars and buildings.
Learn more about NXP Semiconductors
Size
31,000 employees
Market Cap
$39.8 billion
Industry
Net Income
$52 million
Founded
1953
5 Year Trend
+3.1%
Revenue
$8.6 billion
NASDAQ

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