D-Wave Systems

Packaging Specialist II [609]

D-Wave Systems$89K — $122K *
Aerospace & Defense
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Post-secondary technical diploma or equivalent experience
  • 4+ years of experience in assembling complex electromechanical assemblies
  • Skilled in precision microassembly techniques such as die attach and wire bonding
  • Ability to aid in fabrication process development and troubleshooting
  • Strong mechanical aptitude and manual dexterity with delicate components
  • Experience handling technical documentation and experimental records
  • Effective problem-solving and communication skills

Responsibilities

  • Evaluate new packaging materials and designs through hands-on testing
  • Construct experimental hardware and prototypes for cryogenic technologies
  • Engage in speculative packaging concepts for future manufacturing exploration
  • Assess chip package designs and identify manufacturability issues
  • Conduct trials for packaging materials and document findings
  • Assist in creating packaging assembly documentation and work instructions
  • Maintain detailed experimental records and process documentation
  • Collaborate with team members for smooth transition of processes to manufacturing

Benefits

  • Opportunity to own company shares
  • Access to competitive pay and meaningful benefits
  • Culture focused on personal growth and support
  • Commitment to diversity and innovation in the workplace
  • A collaborative environment that values diverse opinions and continuous improvement
Full Job Description
About the role

D-Wave is seeking an experienced Packaging Specialist II to join our Cryogenic Packaging Team.

In this role, you will support the development and refinement of cryogenic packaging processes, materials, and assembly techniques through hands-on experimentation and prototype development. You will build and evaluate experimental hardware, troubleshoot assembly challenges, and contribute practical expertise to the development of next-generation packaging technologies.

You will work closely with scientists, engineers, and technicians to evaluate new designs, identify manufacturability and cryogenic reliability concerns, and help transition successful experimental processes into robust, repeatable manufacturing techniques.

What you'll do

  • Support evaluate new packaging materials, processes, and designs through hands-on experimentation
  • Build experimental hardware and prototypes to support next-generation cryogenic packaging technologies
  • Participate in speculative packaging concepts and look-ahead prototypes to explore future manufacturing capabilities
  • Support evaluate chip package designs, and assist in identifying manufacturability and cryogenic reliability concerns' escalate assembly challenges to senior team members for resolution
  • Execute packaging materials, fabrication, and design trials, documenting observations and helping refine manufacturing methods
  • Assistin documenting packaging assembly techniques and work instructions
  • Maintain accurate experimental records, process documentation, and traceability of materials, assemblies, and process changes
  • Collaborate with scientists, engineers, and technicians to transition successful processes into repeatable manufacturing techniques
  • Read and interpret engineering drawings, assembly instructions, process documentation, and experimental procedures
  • Assemble, inspect, rework, and repair cryogenic electronic assemblies, including die attach, wire bonding, cable assemblies, and other precision microassembly operations
  • Perform precision inspection and verification using microscopes and specialized laboratory equipment
  • Follow safety protocols and maintain specialized tools, equipment, and laboratory work areas
  • Provide general laboratory maintenance and support

About you

  • Post-secondary technical diploma or equivalent combination of education and experience
  • 4+ years of experience assembling complex electromechanical assemblies
  • Experience with precision microassembly techniques such as die attach, wire bonding, soldering, or adhesive application
  • Ability to support fabrication process development and troubleshooting
  • Strong mechanical aptitude, attention to detail, and manual dexterity when working with delicate components
  • Experience with technical documentation, experimental records, and multi-level BOMs
  • Strong problem solving, communication, and collaboration skills
  • Self-motivated, proactive, and able to work accurately with general supervision
  • Commitment to safety, quality, and continuous improvement
  • Ability to sit or stand for extended periods and lift/move objects up to 30 lbs or more

A D-Waver's DNA

  • We look at the future and say "why not"; we see possibilities where others see problems or routines. We show the way ahead and are committed to achieving ambitious goals.
  • We practice straight talk and listen generously to each other with empathy. We value different opinions and points of views. We ensure that we connect outside as well as inside to learn from others and inspire each other.
  • We hold ourselves accountable for delivering results. We make decisions & take responsibility so that we can act & support each other.
  • As leaders we motivate & engage our teams to undertake beyond what they originally thought possible, by developing our teams & creating the conditions for people to grow and empower themselves through enabling & coaching.

Our Compensation Philosophy is Simple but Powerful:

We believe providing D-Wavers with company ownership, competitive pay, and a range of meaningful benefits is the start of creating a culture where people want to give the best they've got - not because they're simply making money, but because they've fallen in love with our vision, mission, values, and team.

During the interview process, your Recruiter will review our total rewards (base, equity, bonus, perks, benefit, culture) offerings. The final offer is determined by your proficiencies within this level.

Inclusion:

We celebrate diverse perspectives to drive innovation in our pursuit. Our employees range from distinguished domain experts with decades of experience in their respective fields, to bright and motivated graduates eager to make their mark. Our diverse and innovative team will make you feel appreciated, supported and empower your career growth at D-Wave.

The base pay range for this role is:

89,000 - 122,000 CAD per year (Burnaby)

About D-Wave Systems

D-Wave Systems is a quantum computing company that designs and manufactures quantum computers and provides quantum computing services. The company was founded in 1999 and is headquartered in Burnaby, British Columbia, Canada. D-Wave's quantum computers are used by government, commercial, and academic customers to solve complex problems in fields such as optimization, machine learning, and cybersecurity. The company's flagship product is the D-Wave 2000Q, a 2048-qubit quantum computer. D-Wave has raised over $200 million in funding from investors including Goldman Sachs and Bezos Expeditions.
Learn more about D-Wave Systems
Size
200 employees
Industry
Founded
1999

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