Substrate Packaging Technology Development (SPTD) is looking for a Packaging Research and Development Engineer to join the Module Engineering Backend Area specifically to be in charge of process and material development to scale advanced substrate packaging technology to enable further die disaggregation / heterogenous integration.

This position requires most of time spent on the factory floor and/or interacting with equipment/material suppliers. The candidate will join and become part of a world class first of a kind embedded die packaging facility, learn advanced substrate manufacturing know-how, drive disruptive technology innovations, and be part of creating history in the substrate packaging industry.

Responsibilities will include but not be limited to:

- Define and establish equipment configurations, process specifications, and integrated process flow for new process technologies
- Plan and conduct comprehensive DOEs to fundamentally characterize process window, and understand process / equipment / materials interactions
- Drive continuous process improvements on process capability/stability, quality/reliability, cost/yield, automation, and productivity
- Lead and participate in cross-functional and cross-organizational teams or work groups that support substrate technology development.

The ideal candidate should exhibit the following behavioral traits and/or skills:

- Written and verbal communication and teamwork skills.
- Interact with equipment and materials suppliers.
- Willingness to travel (some travel may be required, less than 5 percent)
- Work with ambiguity and flexibility with respect to job roles and working hours is required.

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.

Minimum qualifications:

Candidate must possess at least one for the following:

• Bachelor’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 5+ years of experience.
• Master’s degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 3+ years of experience.
• PhD degree in Mechanical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry or related and 1+ years of experience.

Experience listed above should be a combination of the following:

• Semiconductor manufacturing experience
• Semiconductor Technology development
• Material Development

Preferred qualifications:

1+ years of experience in the following:

- Engineering troubleshooting and analytical skills on integrated technology issues and experience working with broad team of other process and integration engineers.
- Experience owning process tools with knowledge of SPC PCS RFCs equipment troubleshooting statistical design of experiments and process development.
- Experience working with a variety of organic/inorganic materials and processes as well as characterizations utilizing techniques such as DSC, TGA, D/TMA, Titration, ICPMS, FTIR, XPS, TOFSIMS, EDX, SEM, etc. is highly desirable.
- Experience with statistical data analysis, JMP and JSL, Python, relational database structure and usage, machine learning.

Become part of Intel's innovative team and take the next step in your career by applying today.

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Work Model for this Role

*