Job Details:Job Description: The Role and Impact
Join Intel's Advanced Packaging Substrate Technology Development team as a Packaging Module Development Engineer and play a pivotal role in shaping the future of advanced packaging solutions. You will be at the forefront of developing cutting-edge assembly processes and equipment that enable Intel's roadmap for innovative assembly packaging technologies. In this role, you will contribute to optimizing manufacturing processes, improving product quality, reliability, and yield, while pushing the boundaries of technology to meet the demands of a rapidly evolving semiconductor industry. You will collaborate with cross-functional teams, explore innovative solutions, and drive breakthroughs in packaging technology that directly impact Intel's success in the global market.
This position is ideal for candidates who enjoy hands-on engineering work and are interested in developing as a Tool Owner and Process Owner within Intel's advanced manufacturing environment.
Key Responsibilities
- Develop and support advanced assembly processes and equipment for next-generation substrate packaging technologies.
- Plan and execute Design of Experiments (DOEs) to support process optimization and evaluate process, material, and equipment interactions.
- Apply statistical analysis and data-driven methodologies to improve quality, reliability, process capability, manufacturing efficiency, and cost.
- Partner with Procurement and Supplier Quality teams to establish material specifications and support supplier performance and material quality.
- Contribute to process improvements through continuous improvement methodologies and engineering best practices.
- Troubleshoot packaging and manufacturing issues using engineering principles and analytical problem-solving techniques.
- Collaborate with cross-functional teams to resolve process and technology challenges supporting substrate technology development.
- Support process documentation, standardization activities, and preventive and corrective maintenance procedures.
- Work with equipment and material suppliers to support the development and qualification of new tools and materials.
- Contribute to the design, development, and qualification of advanced substrate packaging technologies, including EMIB and Co-EMIB.
Behavioral Traits
In addition to the qualifications listed below, the ideal candidate should demonstrate the following:
- Passion for hands-on manufacturing and working in a factory environment.
- Strong desire to learn and grow as a tool owner and process owner.
- Self-motivated with a continuous learning mindset.
- Strong problem-solving and analytical thinking skills.
- Effective written and verbal communication skills.
- Ability to collaborate with cross-functional teams.
- Adaptability and willingness to work in a fast-paced manufacturing environment.
- Genuine interest in building a long-term career with Intel.
Qualifications:Minimum Qualifications
- Candidates must meet one of the following education and experience requirements:
- Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or a related engineering discipline with 1+ year of relevant experience.
- Master's degree in one of the above disciplines with no prior experience required.
- PhD in one of the above disciplines with no prior experience required.
Required Technical Qualifications
- Knowledge of manufacturing process control and equipment adjustment.
Preferred Qualifications
- Experience with Design of Experiments (DOE) principles and statistical data analysis.
- Experience with Statistical Process Control (SPC).
- Experience using process development or statistical analysis tools such as JMP or Python.
- Experience troubleshooting engineering or manufacturing processes while collaborating with cross-functional teams.
- Background in organic and inorganic materials and characterization techniques such as DSC, TGA, FTIR, XPS, SEM, or similar.
- Familiarity with machine learning techniques and relational databases for data analysis and modeling.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location: US, Arizona, Phoenix
Additional Locations:
Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
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