Packaging Engineer 1

Job Description:

RFIC package development, supporting NPI from concept through production release. This individual will work with product and design engineers to deliver optimum, cost effective packaging solutions as well as providing thermal design and analysis for IC package and system level physical designs. Package types include plastic molded leadframe packages, ceramic packages, metal packages, and pallets for RF and Microwave IC's. This individual may be required to work on multiple product development programs in parallel to deliver packaging solutions on schedule for high volume manufacturing.

Key Responsibilities
• Provide technical support for RF/microwave plastic, ceramic, and metal packages along with pallets
• Work with internal product design, QA, Reliability, Failure Analysis, supply chain, and the external suppliers to develop and apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, high volume manufacturability, yield and quality
• Provide thermal and mechanical modeling for new packages and for improving existing package designs
• Update design rules for packaging as required
• Participate in and contribute to assembly process development internally and at our contract manufacturers
• Participate in troubleshooting IC packaging defects, then define and implement solutions

Key Qualifications and Experience
• BS in Mechanical Engineering, Materials Science, or related field
• Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software
• Experience with AutoCAD is desired
• Ability to work effectively on multiple projects at a time
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plans at team meetings
• Good teamwork skills in working together to achieve goals
• Basic understanding and use of statistical techniques such as DOE and SPC.
• Experience with IC package design and process development, with emphasis on RF and Microwave IC's, is a plus
• Basic knowledge of high-volume RFIC and Microwave IC assembly processes (die attach, flip chip, wafer saw, wire bond, surface mount, package singulation, etc.) is a plus
• Understanding of relationship between materials and package performance is a plus
• Experience in failure analysis methodology is a plus

RSU Eligible
This position is eligible to receive restricted stockunit (RSU) awards and cash bonuses, solely at MACOM's discretion, subject toindividual and company performance.

Benefits: This position offers a comprehensive benefits package including but not limited to:
• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.