Package Process Development - Sr. Manager, Engineering

Posting Start Date: 9/16/26

Job Location(s): Irvine

Requisition ID: 78361

Job Description:

Description

We are seeking an experienced and highly motivated Senior Manager, Package Process Development to lead the development and industrialization of advanced RF System-in-Package (SiP) technologies. This role will be responsible for driving package process innovation, leading New Technology Introduction (NTI) activities, and establishing robust manufacturing processes that enable high-volume production of next-generation RF modules and SiP products.The ideal candidate possesses deep expertise in RF SiP packaging technologies, assembly processes, process characterization, reliability requirements, and manufacturing scale-up. This individual will collaborate closely with product design, package design, technology development, suppliers, and manufacturing teams to accelerate technology readiness and product commercialization.

Key Responsibilities

Technology Development & NTI

• Lead New Technology Introduction (NTI) activities for advanced RF SiP packaging platforms.
• Develop process roadmaps and technology strategies to support future RF module and SiP product requirements.
• Evaluate and introduce innovative assembly, interconnect, molding, substrate, shielding, and packaging technologies.
• Drive Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Reliability (DFR) initiatives during product development.
• Partner with cross-functional teams to ensure seamless transition from technology development into production.

Package Process Development

• Own development and optimization of RF SiP assembly processes, including:
  • Die Attach
  • Flip Chip Assembly
  • Wire Bonding
  • Wafer-Level Packaging Integration
  • Underfill
  • Encapsulation/Molding
  • Shielding Processes
  • SMT and Board-Level Assembly
• Define process windows, critical process parameters, and control methodologies.
• Lead DOE (Design of Experiments), process characterization, root cause analysis, and yield improvement initiatives.
• Establish process specifications, qualification plans, and manufacturing standards.

Manufacturing Readiness & Production Transfer

• Drive process development activities from concept through production release.
• Lead pilot builds, engineering builds, process qualification, and production ramp readiness assessments.
• Develop process control plans and monitoring strategies to ensure consistent manufacturing performance.
• Work closely with OSATs, subcontractors, equipment vendors, and manufacturing partners to implement scalable production solutions.
• Support factory transfer and production ramp-up activities.

Reliability & Quality

• Partner with reliability and quality engineering teams to ensure package/process robustness.
• Define package qualification requirements and reliability stress test plans.
• Lead failure analysis investigations and corrective action implementation.
• Ensure compliance with customer, industry, and regulatory reliability requirements.

Leadership & Team Development

• Build and lead a high-performing package process development team.
• Provide technical mentorship and career development for engineers.
• Foster a culture of innovation, accountability, and continuous improvement.
• Coordinate activities across global engineering, manufacturing, and supplier organizations.

Required Qualifications

• MS or PhD in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related field.
• 12+ years of semiconductor packaging experience with at least 3 years in a technical leadership or management role.
• Strong hands-on experience in RF SiP package development and assembly process engineering.
• Proven track record of successfully launching new package technologies into mass production.
• Deep understanding of semiconductor package assembly processes and equipment.
• Experience with NTI programs and technology transfer to manufacturing.
• Strong knowledge of statistical process control, DOE, FMEA, SPC, and process qualification methodologies.
• Experience working with OSATs and external manufacturing partners.
• Excellent problem-solving, communication, and cross-functional leadership skills.

Desired Experience and Skills

• Extensive experience with RF front-end modules, wireless communication products, or advanced SiP technologies.
• Knowledge of RF performance impacts associated with package structures and assembly processes.
• Experience with advanced packaging technologies such as:
  • Fan-Out Packaging
  • Wafer-Level Packaging (WLP)
  • Panel-Level Packaging (PLP)
  • Heterogeneous Integration
  • Multi-Chip Modules (MCM)
  • Embedded Component Technologies
• Strong understanding of package reliability physics and failure mechanisms.
• Experience supporting automotive, mobile, Wi-Fi, Bluetooth, GNSS, or cellular RF products.

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The typical base pay range for this role across the U.S. is currently USD $143,000 - $286,400 per year. Starting base pay will depend on relevant experience and skills, training and education, business needs, market demands, the ultimate job duties and requirements, and work location. Skyworks has different base pay ranges for different work locations in the U.S. Benefits include access to healthcare benefits (including a premium-free medical plan option), a 401(k) plan and company match, an employee stock purchase plan, paid time off (including vacation, sick/wellness, parental leave), among others. Employees are eligible to participate in an incentive plan, and certain roles are also eligible for additional awards, including recognition and stock. These incentives and awards are based on individual and/or company performance.