Package Architect, Nexperia USA Inc., Richardson, TX:

Subject matter expert on semiconductor packaging and assembly. Formulate package strategy and roadmap esp for Product Group "Low Power Distribution & Protection (MAG R04)". Accountable to act as recognized leader within the site and/or BG as expert in Packaging. Responsible for functionality & performance of the package design. In charge of delivering key technical contributions to innovation and optimization projects with the focus on packaging. Accountable to build up and broaden own competencies, to influence direction on BG level. Responsible to advise internal and external customers in own field of expertise. Responsible to analyze technology and application trends and to derive innovative solutions, influencing BG directions. Lead cross-functional teams for NPI-package related projects. Generation of new design concepts and patent ideas.

Full time employment, Monday - Friday, 40 hours per week.

Minimum Requirements:

Bachelor's degree in Electronics Engineering, Mechanical Design, Physics, Materials, or a related field and 8 years of progressive, post-baccalaureate work experience.

Of the required experience, must have experience in all the following:
• 7 years of experience with semiconductor packages, semiconductor assembly materials, and semiconductor assembly processes;
• 7 years of experience with 6sigma-methodology including DoE and Data Analysis;
• 7 years of experience with semiconductor reliability tests and failure modes; and
• 5 years of experience with Project Management in the semiconductor industry.

Telecommuting permitted up to 3 days per week.

International travel required up to 5%; Domestic travel required up to 5%.

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