About the roleAs an Optomechanical Engineer at fab2, you'll work with a full-stack team to develop the complete set of tools and processes for fabricating semiconductor packaging devices.
We are seeking a hands-on engineer with deep expertise in designing laser-based systems and a passion for exploring new technologies. This person will play a critical role in developing hardware and optimizing processes that create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating novel methods into semiconductor packaging processes.
Responsibilities- Own optomechanical system development from concept through operation, including mechanical design, optical layout, precision assembly, wiring, controls integration, alignment, and debug.
- Develop laser micromachining processes and equipment, including vision-based alignment and inspection systems.
- Create and validate novel IC packaging processes, from early experiments through repeatable multi-step process flows.
- Plan and execute experiments across deposition, etch, lithography, bonding, die attach, and related packaging processes.
- Collaborate closely with process, mechanical, electrical, controls, and software engineers to move quickly from concept to working hardware.
- Create and maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements for safe, reliable, and repeatable operation.
Required Experience - Hands-on experience designing, building, integrating, or fundamentally modifying process equipment or scientific instruments
- Experience with optomechanical system design and integration, including mechanical design, optics, precision assembly, wiring, controls, alignment, and system debug
- Experience developing laser micromachining processes and working with vision-based alignment systems
- Proficiency in metrology and failure analysis, including developing custom tools or methods to quantify process performance and improvement
- Ability to work independently in a fast-moving R&D environment and take ownership from initial concept through functional hardware and validated process results
Nice-to-have- Experience with metal plating
- Exposure to advanced semiconductor packaging technologies, including interposers, through-vias, redistribution layers (RDL), hybrid bonding, thermocompression bonding, flip chip, and underfill
- Experience with ultrafast laser micromachining
Compensation: fab2 is committed to fair and equitable compensation practices. The annual salary range for this role is $130,000 - $180,000. Compensation is determined based on your qualifications and experience. Our total compensation package also includes generous equity in fab2.
Benefits: fab2 Semi offers the following benefits, subject to applicable eligibility requirements:
- Medical, Dental, and Vision insurance
- Generous Paid Time Off inclusive of Holidays and Sick Time
- Visa Sponsorship
- Life and Disability Insurance
- Paid Parental Leave
- 401(k) retirement plan
- Weekly Learning & Development opportunities
- Commuter Benefits including Parking and Late Night Uber rides from the office
- Lunches daily, Dinners 3x per week, Stocked Office Kitchen with Snacks and Spindrifts
