Qualifications

• Ph.D. in Electrical Engineering or Physics with 2+ years of industry experience, or MSEE with 6+ years.
• Experience designing and characterizing high-speed optoelectronic interfaces like drivers and modulators.
• Expertise in Signal Integrity principles and 3D electromagnetic design using software like 3DS CST or ANSYS HFSS.
• Knowledge of IC packaging materials and techniques, along with microelectronics assembly process flows.
• Familiarity with high-speed testing equipment such as network analyzers and oscilloscopes.
• Strong technical writing and interpersonal communication skills.
• Knowledge of semiconductor fabrication processes is a plus.

Responsibilities

• Conduct leading research in optoelectronic interface design for high-speed optical networks.
• Investigate novel integration techniques for EIC/PIC and advanced packaging materials.
• Collaborate with Nokia Bell Labs and business units on optical subassembly advancements.
• Define materials, integration approaches, and assembly processes for next-gen optical subsystems.
• Design and optimize high-speed optoelectronic interfaces using EDA simulation tools.
• Perform high-frequency testing and measurements with various modulation formats.
• Write patents and publications leveraging strong technical documentation skills.

Benefits

• Access to cutting-edge research facilities at Nokia Bell Labs.
• Opportunity to collaborate with industry-leading experts.
• Exposure to advanced technologies in optical systems.
• Possibility of contributing to groundbreaking innovations in high-speed networks.