Summary of Role: GlobalFoundries Fab8 is seeking an experienced and dedicated R&D engineer, joining Advanced Packaging Lab (APL) to lead advanced 3D Heterogeneous Integration (3D-HI) initiatives, such as wafer-to-wafer hybrid bonding, die-to-wafer hybrid bonding, TSV/TOV, and interposer development.
Essential Responsibilities:- Drive 3D-HI process development efforts for the building blocks required for advanced packaging solutions needed by the GlobalFoundries product lines (e.g., multi-die stacking, die-to-wafer / wafer-to-wafer fine pitch hybrid bonding, etc.).
- Partner with unit process engineers, manufacturing engineers, as well as directly with the tool and material vendors for the GlobalFoundries fabs.
- Collaborate joint development projects with partners to develop new wafer level and die level 2.5D and 3D Heterogeneous Integration (3D-HI) processes.
- Drive end-to-end process integration and planning to enable new capabilities and early product prototyping across multiple programs.
- Develop expertise in processes, materials, and tooling, and make efficient use of characterization resources.
- Drive data analysis, interpretation of results, and understanding of failure modes.
- Identify and resolve process integration issues and related challenges.
- Generate IP related to novel wafer integration and packaging technology.
Other Responsibilities: - Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
- Participate in hiring activities.
- Mentor and guide new hires to assume their roles and responsibilities.
- Other duties as assigned by manager.
Required Qualifications: - Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
- MS degree with at least 5-6 years of prior related work experience.
- In depth knowledge of BEOL processes and integration (advanced bonding, TSVs), bump/wafer finish integration, wafer test/probe, OSAT collaboration, and package development & assembly.
- Strong problem solving and technical trouble shooting skills including expertise in design of experiment.
- Must have at least an overall 3.0 GPA and proven good academic standing.
- Language Fluency - English (Written & Verbal).
- Travel - Up to 20%.
Preferred Qualifications: - Education - PhD education level preferred with at least 3-4 years of prior related work experience.
- Demonstrated prior leadership experience internally or with an OSAT eco-system.
- Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
- Strong written and verbal communication skills.
- Strong planning and organizational skills.
Expected Salary Range$98,000.00 - $176,000.00
The exact Salary will be determined based on qualifications, experience and location.
