Renesas Electronics America

Module Product Engineer

Renesas Electronics America$100K — $130K *
Tempe, AZ 85281In-Person
Manufacturing & Automotive
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or related field required; Master's preferred
  • 10+ years in semiconductor product or manufacturing engineering with NPI to high-volume production experience
  • Deep technical knowledge of semiconductor power products and advanced power module manufacturing
  • Strong data analysis capabilities for interpreting statistical results and driving decisions
  • Familiar with new product development, qualification, and manufacturing transfer
  • Excellent communication skills for customer and cross-functional team interactions
  • Proven leadership in complex technical decision-making and execution across organizations

Responsibilities

  • Own product engineering execution from NPI through high-volume production
  • Drive the manufacturability of advanced power modules across OSAT and internal manufacturing sites
  • Establish and enforce compliance with IPC-A-610 assembly workmanship standards
  • Facilitate cross-functional collaboration across Design, Test, Quality, and Manufacturing teams
  • Lead resolution of assembly-related issues, such as die attach and module defects
  • Oversee product bring-up, characterization, and silicon readiness
  • Define and maintain product specifications and limits based on manufacturing capabilities
  • Conduct yield analysis, parametric trend monitoring, and investigations
  • Drive cost, yield, and cycle-time improvements using data-driven approaches
  • Manage manufacturing release, qualification execution, and product change management

Benefits

  • 10% travel requirement for customer engagement
  • Opportunity to lead complex projects in a high-impact role
  • Engagement with cross-functional teams to influence product quality
  • Potential for professional growth in a rapidly advancing technological field
Full Job Description
Job Description

Seeking an experienced Product Engineer (PE) to own the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. This role is accountable for end-to-end product execution across design, test, quality, assembly, and manufacturing to deliver performance, quality, cost, and schedule targets at scale.

Key Responsibilities
  • Own product engineering execution for advanced power modules from NPI through high-volume production and sustaining
  • Own the manufacturability of advanced power modules, driving robust assembly processes across OSAT and internal manufacturing sites
  • Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610 (Acceptability of Electronic Assemblies)
  • Drive cross-functional alignment across Design, Test, Quality, and Manufacturing to enable scalable, high-yield module production
  • Lead resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects
  • Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams
  • Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability
  • Lead yield analysis, parametric trend monitoring, and root-cause investigations
  • Drive cost, yield, and cycle-time improvement through data-driven analysis
  • Own manufacturing release, qualification execution, and product change management (PCNs)
  • Serve as the technical escalation owner for production issues, customer returns, and corrective actions
  • Support critical customer engagements on product, quality, and manufacturing topics as needed
  • 10% travel


Qualifications

Education:
  • Bachelor's degree required in Electrical Engineering, Computer Engineering, or a related field; master's degree in a relevant engineering discipline preferred. Mechanical Engineering degree preferred, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.


Experience & Skills:
  • 10+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production
  • Strong technical depth in semiconductor power products and advanced power module manufacturing
  • Strong data analysis skills with the ability to interpret statistical results and drive decisions
  • Working knowledge of new product development, qualification, and high-volume manufacturing transfer
  • Strong written and verbal communication skills with customers and cross-functional teams
  • Proven ability to lead complex technical decisions, escalations, and execution across organizations


Additional Information

Videos To Watch
https://www.youtube.com/embed/k-zs4tB6nNc

About Renesas Electronics America

Renesas Electronics America is a leading supplier of advanced semiconductor solutions including microcontrollers, SoC solutions and a broad range of analog and power devices, with operations spanning research, development, design and manufacturing for a wide range of applications.
Learn more about Renesas Electronics America
Size
2,000 employees
Industry

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