Job Details:Job Description:We are seeking a talented and driven
Module Development Engineer to join our Technology Development team in
Hillsboro, Oregon. In this role, you will be a key contributor to the development and optimization of Intel's most advanced semiconductor manufacturing processes. You will work at the intersection of materials science, process engineering, and device physics - conducting experiments, developing novel process solutions, and collaborating with world-class teams to bring next-generation semiconductor technologies to life. This is a rare opportunity to work on technology that is truly at the frontier of human knowledge, in one of the most advanced semiconductor R&D facilities in the world.
Key Responsibilities:- Develop, optimize, and sustain advanced semiconductor manufacturing processes, including material selection, equipment metrology, parameter tuning, and system design
- Design and execute structured experiments (DOE) to achieve engineering specifications for device functionality, yield, and production output
- Conduct feasibility studies and pathfinding efforts to support innovative device architectures and next-generation manufacturing roadmaps
- Collaborate with equipment and materials suppliers to evaluate, qualify, and implement novel technology solutions into manufacturing processes
- Perform process technology feasibility studies using theoretical simulations and practical engineering techniques
- Stay current on industry trends and technology advancements to align development efforts with evolving semiconductor needs
- Partner with cross-functional stakeholders and vendors to develop cost-effective technology roadmaps and meet operational goals
As a Successful Candidate, You Will Bring:- A natural curiosity and passion for solving complex, ambiguous technical challenges.
- Strong communication skills and the skills to clearly convey technical concepts to diverse audiences.
- A collaborative mindset and genuine enjoyment of working across interdisciplinary teams.
- Adaptability and resilience in a fast-paced, dynamic research and development environment.
- A detail-oriented approach balanced with the willingness to see the bigger picture.
- Self-motivation and the drive to take ownership of projects and deliver results.
- An inclusive and respectful approach to teamwork that values diverse perspectives.
If you're excited by the idea of working on technology that doesn't yet exist - and you want to be part of a team that is redefining what's possible in chip manufacturing - we'd love to hear from you.
Qualifications:This is an entry level position and will be compensated accordingly. You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research and relevant previous job and/or internship experience. This Position is not eligible for Intel immigration sponsorship.
Minimum Qualifications:- Bachelor's degree in mechanical engineering, Materials Science, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field, with 4+ years of hands-on semiconductor processing experience as described below - OR - Master's degree in a relevant field listed above, with 3+ years of domain-specific experience as described below - OR - PhD in a relevant field listed above (no prior professional experience required)
- Relevant experience includes one or more of the following:
- Process characterization, Statistical Process Control (SPC), and/or Design of Experiments (DOE)
- Knowledge of semiconductor manufacturing techniques, including lithography, etching, deposition, and/or chemical-mechanical planarization (CMP)
- Experimental design, data analysis, and/or manufacturing process improvement
- Expertise in thin film deposition technologies, vacuum process systems, and/or opto-mechanics
Preferred Qualifications:- 4+ years of experience in:
- Advanced transistor architectures (FinFET, GAA) and semiconductor device fabrication
- Materials characterization methods: SEM, TEM, XPS, ellipsometry, or similar techniques
- Programming or scripting experience in Python, JMP, or MATLAB for process optimization or data analysis
Job Type:College Grad
Shift:Shift 1 (United States of America)
Primary Location:US, Oregon, Hillsboro
Additional Locations:Position of TrustN/A
BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
