mmW/RF/Analog Circuit Design Engineer(7083)

Taiwan Semiconductor Manufacturing Company Limited

$166K — $250K *
Telecommunications & Hardware
11 - 15 years of experience
Job Overview by Ladders

Qualifications

  • Master's or Ph.D. in Electrical/Computer Engineering or related field.
  • 15+ years in mmW/RF/Analog circuit design for communication applications.
  • Proven tape-out experience in delivering commercial designs.
  • Strong grasp of RFIC fundamentals (noise, stability, power efficiency).
  • Proficient in tools like Cadence Virtuoso, Spectre RF, and MATLAB.
  • Solid understanding of semiconductor device physics and processing technology.
  • Excellent communication skills for cross-functional collaboration.

Responsibilities

  • Design and validate mmW/RF/Analog building blocks.
  • Collaborate on design-technology co-optimization for advanced nodes.
  • Work with test engineers to ensure silicon-to-simulation accuracy.
  • Develop electromagnetic isolation methodologies for integration.
  • Mentor junior designers and contribute to a culture of innovation.

Benefits

  • Relocation support and visa sponsorship for exceptional candidates.
  • Opportunity to work on cutting-edge challenges in semiconductor technology.
  • Environment that fosters collaboration and personal growth.
  • Potential to publish high-impact research and engage in global projects.
Full Job Description
Overview of Role

We are seeking a highly motivated mmW/RF/Analog Circuit Design Engineer to join TSMC's RF design team and pioneer the use of advanced technology nodes in RF and mmWave circuit design. This role is central to developing TSMC's future methodologies, leveraging innovative semiconductor technologies, and strengthening TSMC's competitive position against leading global foundries.

The position offers an opportunity to work with world-class technology, publish high-impact research, and engage in cross-functional collaborations across the U.S. and Taiwan. Successful candidates will be strong individual contributors who can grow into mentors and future leaders.

Responsibilities
  • RFIC Design & Methodology - Design, simulate, and validate mmW/RF/Analog building blocks (LNAs, mixers, TIAs, VCOs, PLLs, LOGENs, etc.), while developing robust methodologies and design flows for the team.
  • Design-Technology Co-Optimization (DTCO) - Partner with technology development teams to push transistor-level feasibility and achieve PPA (power, performance, area) breakthroughs in advanced nodes.
  • Silicon Validation - Collaborate with test engineers to drive accurate silicon-to-simulation correlation, debugging, and optimization.
  • Electromagnetic Simulation - Create and validate EM isolation methodologies for on-chip, package, and PCB integration.
  • Mentorship - Initially operate as an independent contributor; gradually mentor junior designers and foster a culture of innovation.


Minimum Qualifications
  • Master's or Ph.D. in Electrical/Computer Engineering or related field.
  • 15+ years direct experience in mmW/RF/Analog circuit design for wireless/communication applications.
  • Proven tape-out experience and direct involvement in delivering commercial designs.
  • Demonstrated hands-on experience in the design of mixed-signal, analog, RF, or high-speed link circuits for wireless or wireline products.
  • Strong understanding of RFIC fundamentals (noise, linearity, stability, mismatches, power efficiency, impairments).
  • Expertise in tools: Cadence Virtuoso, Spectre RF, ADS, MATLAB, EMX, HFSS.
  • Solid knowledge of semiconductor device physics and process technology.
  • Strong analytical skills and the ability to translate system requirements into design specifications.
  • Excellent communication skills and willingness to work across Taiwan and U.S. teams.


Preferred Qualifications
  • Ph.D. with strong publication record (patents, journals, conferences).
  • Familiarity with RF transceiver architectures and design trade-offs.
  • Experience in mixed-signal verification methodologies.
  • Proficiency in Python/Perl/Tcl for design automation.
  • Prior exposure to AI/ML-based design optimization.
  • Knowledge of reliability analysis (EM, IR-drop, thermal effects) and design for testability.
  • Familiarity with semiconductor ecosystem.


Location

Primary location: San Diego, CA or Hsinchu, Taiwan.
Relocation support and visa sponsorship may be considered for exceptional candidates.
Some travel to Taiwan HQ expected.

Pay Transparency / Benefits statement

At TSMC, your base pay is only part of your overall total compensation package. At the time of this posting, this role typically pays a base salary between $166,000 and $250,000 per year. The range displayed reflects the minimum and maximum target for new hires. Actual pay may be more or less than the posted range. Factors that influence pay include the individual's skills, qualifications, education, experience and the position level and location. TSMC's total compensation package consists of market competitive pay, allowances, bonuses, and comprehensive benefits. We also offer extensive development opportunities and programs.

For roles hired outside of California, including other U.S. states or international locations such as Taiwan, compensation may vary in accordance with local market practices, legal requirements, and TSMC's regional compensation framework.

Date: Jul 2, 2026

Country/Region: US

City: San Diego

Company: TSMC Technology, Inc.

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