Job Details:

Job Description:

Note: This role requires regular onsite presence when managing employees whose responsibilities necessitate onsite work. Managers of onsite essential roles are expected to be onsite to support operational needs. Manages a team of yield development engineers and technicians providing leadership on factory operation support and driving yield improvement roadmaps.

The LYA Group Leader / Operations Manager will be responsible for:

• Evaluating methods and tools continually to drive defect reduction and yield improvement including driving and guiding development efforts with core competency and metrology groups.
• Developing Strategies for optimal inline monitoring scheme and invents methods including custom process flows and test layout designs to detect EOL fails inline.
• Developing and deploys tools, algorithms, and methodologies for generation and analysis of in-line and offline yield and defect data, applies statistical methods, and draws meaningful conclusions to help direct the efforts of the organization. Develops recommendations, drives yield, defects indicators, and manages communications with factory.
• Demonstrates ability to develop and harden equipment capable of meeting technology development and high-volume manufacturing operational and capability needs for leading edge logic node.
• Develops long-term strategies for process integration and yield engineering capabilities to support future requirements.
• Responsible for enabling teams to execute through clear goal setting, facilitating work, maintaining accountability, applying differentiated performance management, and driving team results.
• Drives results by inspiring people, role modeling Intel values, developing the capabilities of others, and ensuring a productive work environment.

The low yield analysis (LYA) group leader/operations manager (GL/OM) will be responsible for overseeing the start-up of a new laboratory focused on back-end advanced package fault isolation and failure analysis in Chandler, Arizona. The group leader will also manage a team of engineers and technicians focused on both characterization of in-line defects and fault isolation and subsequent failure analysis. Familiarity with capital equipment sourcing and install/qualification methodology will be critical in tandem with previous people management experience of diverse teams.

The GL/OM will be expected to utilize strong presentation skills, interfacing with peer groups and upper management towards driving overall program success in tandem with helping define data acquisition strategies and data analysis plans towards yield improvement.

Other focus areas may include process and defect characterization, forecasting and driving implementation of forward needs for the broader organization and developing innovative techniques/approaches to accelerate failure identification and root cause mechanism understanding.

Qualifications:

Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:
• Must possess a Master's Degree with 4+ years of experience or PhD with 2+ years of experience in Chemistry, Physics, Electrical Engineering, Mechanical Engineering, Materials Science or other relevant applied Engineering Degree.
• US Citizenship is required
• Ability to obtain and maintain a US Government TS/CSI Security Clearance with Polygraph
• 2+ years' experience with Semiconductor or Advanced Manufacturing.
• 1+ year experience with capital equipment management and /or sourcing.
• 1+ years' experience as a personnel manager or lead / mentor.

Preferred Qualifications:
• 8+ years Advanced Manufacturing or operations management experience.
• Active US Government TS/CSI Security Clearance with Polygraph
• Previous experience in personnel management, preferably managing both technicians and exempt employees.
• Experience with capital equipment sourcing and install/qualification methodology.
• Knowledge of advanced packaging architectures, especially utilizing 2.5D and 3D disaggregation techniques.
• Experience with device physics and common Si fail modes and mechanisms.
• Experience with test program development and evaluations - especially parametric tests.
• Experience with electrical fault isolation of parametric structures.
• Familiarity with fab wafer processing, especially back-end processing and advanced packaging assembly techniques.
• Knowledge of sample preparation and equipment for failure analysis such as: mechanical cross-sectioning, planar grinding, de-lidding, FIB and SEM/TEM analysis.
• Good written and oral communication skills.
• Demonstrated problem solving, analytical and engineering trouble shooting capabilities previously.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Benefits at Intel

Our total rewards package goes above and beyond just a paycheck. Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals. Go to Intel Benefits | Intel Careers for details of benefits available to you. Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.

Job Type:
Experienced Hire

Shift:
Shift 1 (United States of America)

Primary Location:
US, Arizona, Phoenix

Additional Locations:

Business group:
Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $155,520.00-255,200.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.