Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

As a Lead Product Manager, AI Storage Solutions you will define the strategic vision, roadmap, and execution plan for next-generation memory solutions that enable cutting-edge AI, Machine Learning, and High-Performance Computing ecosystems. You will serve as the connective tissue across engineering, marketing, operations, and hyperscale customers-driving competitive differentiation and business growth for high-performance memory products.

Key Responsibilities
Strategic Product Leadership
Own the multi-year product roadmap, aligning with technology inflection points such as AI Storage Solutions, and emerging AI Storage Solutions architectures. Translate market dynamics, customer signals, and competitive insights into product requirements (MRD/PRD).

Customer & Market Engagement
Lead deep technical engagements with hyperscalers and chipmakers (e.g., NVIDIA, AMD), turning customer performance, latency, and capacity needs into engineering deliverables.
Position product solutions for AI inference, KV-cache, and memory-centric architectures informed by industry trends, inference context memory, KV-tiering.

Business & Financial Ownership
Build business cases including TAM/SAM/SOM models, pricing strategies, investment requirements, and ROI modeling. Guide lifecycle execution from concept 1 development 1 through cross-functional program reviews (Stage Gate).

Execution & Cross-Functional Leadership
Partner closely with ASIC, firmware, NAND, system, and quality teams to drive technical readiness and performance targets. Manage supplier relationships and work with supply chain to ensure cost, yield, and delivery success. Coordinate internal alignment with engineering, reliability, operations, and exec staff.

Competitive Intelligence
Maintain a robust understanding of the semiconductor memory landscape-AI Storage Solutions competition, NAND-AI Storage Solutions, emerging AI architectures, and customer platform roadmaps.

Technical Expertise
Strong understanding of:
3D stacking / TSV
Memory-accelerator integration (AI/ML GPU pipelines)
Memory subsystem architecture and performance analysis
AI Storage Solutions, NAND-based high-bandwidth architectures

Qualifications

REQUIRED:

• Bachelors degree in Electrical Engineering, Computer Science, Engineering, or related field. MBA preferred.
• Minimum of 8+ years of experience in product management
• Minimum of 2 years experience in AI Architectures for datacenters or on-device
• Strong desire to take ownership of the full product lifecycle
• Proven track record of managing and launching successful emerging technology products.
• Deep understanding of flash memory technology and AI Storage Solutions, 3D stacking, TSV architectures. NAND-based high bandwidth architectures.
• Any knowledge of AI software stack will be a added advantage.

Preferred:

• Strong analytical and strategic thinking skills, with the ability to translate market trends into actionable product strategies.
• Excellent leadership and communication skills, with experience leading cross-functional teams.
• Experience presenting to senior level audiences
• This is an Individual contributor (IC) role. Any people management skills will be an added advantage

Compensation & Benefits Details

• An employees pay position within the salary range may be based on several factors including but not limited to (1) relevant education; qualifications; certifications; and experience; (2) skills, ability, knowledge of the job; (3) performance, contribution and results; (4) geographic location; (5) shift; (6) internal and external equity; and (7) business and organizational needs.
• The salary range is what we believe to be the range of possible compensation for this role at the time of this posting. We may ultimately pay more or less than the posted range and this range is only applicable for jobs to be performed in California, Colorado, New York or remote jobs that can be performed in California, Colorado and New York. This range may be modified in the future.
• You will be eligible to participate in Sandisks Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance. Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan. Please note that not all roles are eligible to participate in the LTI program, and not all roles are eligible for equity under the LTI plan. RSU awards are also available to eligible new hires, subject to Sandisks Standard Terms and Conditions for Restricted Stock Unit Awards.
• We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Sandisks Savings 401(k) Plan.
• Note: No amount of pay is considered to be wages or compensation until such amount is earned, vested, and determinable. The amount and availability of any bonus, commission, benefits, or any other form of compensation and benefits that are allocable to a particular employee remains in the Companys sole discretion unless and until paid and may be modified at the Companys sole discretion, consistent with the law.