Lead Hardware System Architect

Bolt Graphics

• $200K — $250K *
Telecommunications & Hardware
8 - 10 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical discipline.
  • 8+ years of hardware design experience with high-performance graphics hardware.
  • Deep, hands-on experience with PCIe Gen 5/6 and high-speed serdes (112G/224G PAM4).
  • Strong understanding of high-frequency PCB layout constraints and power delivery networks.
  • Proficiency with advanced EDA tools such as Cadence Allegro and OrCAD.

Responsibilities

  • Architect system-level considerations for high-performance graphics platforms.
  • Design and optimize complex PCB topologies with advanced interconnect technologies.
  • Collaborate with cross-functional teams to develop robust board stack-ups and power zones.
  • Oversee integration of management infrastructure including telemetry and BMCs.
  • Interface as the primary technical authority with international JDM/ODM teams.
  • Lead hardware debug and failure analysis during platform bring-up.
  • Enforce design reviews and compliance with DFX standards for manufacturing transitions.

Benefits

  • Medical, Dental, & Vision - 100% covered premiums
  • Equity - Stock Options
  • 401(k) match
  • WFH Equipment Reimbursement
Full Job Description
About the role:

As the Lead Hardware System Architect, you will own the end-to-end hardware development lifecycle for our next-generation graphics compute platforms, high-performance GPU servers, and ultra-high-speed PCIe graphics form factors. You will act as the technical bridge between advanced graphics silicon packaging and system-level deployment, driving physical architecture, functional partitioning, and high-speed fabric optimization for massive graphics workloads and real-time rendering infrastructure.

In this role, you will not just oversee board layouts; you will define the physical topologies that enable cutting-edge graphics compute scaling. You will serve as the ultimate technical escalation point for our global JDM/ODM engineering partners, steering them through complex bring-up, signal integrity boundaries, and root-cause failure analysis to deliver flawless graphics hardware on schedule. This role is on-site, 5 days a week.

What you'll do:

1. Physical System Architecture & High-Performance Graphics Design

  • Architect the Platform: Drive system-level architectural trade-offs, balancing high-performance GPU silicon package constraints, high-speed routing density, thermal mechanics, and ultra-high-density power delivery networks (PDNs).
  • Own High-Speed Topologies: Design and optimize complex PCB topologies utilizing PCIe Gen 5/Gen 6 (CEM specifications) and proprietary/consortium scale-up interconnect fabrics designed for parallel compute and graphics scaling (e.g., NVLink, Infinity Fabric, UA Link).
  • Systemic Co-Design: Collaborate with Silicon, Signal/Power Integrity (SI/PI), and Thermal/Mechanical teams to define robust board stack-ups, low-loss material selection, and multi-phase power zones handling massive transient loads from modern graphics processors.
  • Management Integration: Ensure seamless integration of out-of-band telemetry and management infrastructure, designing physical routing for Baseboard Management Controllers (BMCs), SPI, and I2C/SMBus topologies.

2. Technical JDM/ODM & Supplier Governance

  • Lead Technical Enablement: Serve as the primary technical authority interfacing with international JDM/ODM layout and hardware engineering teams.
  • Triage & Failure Analysis: Lead complex hardware debug, component-level troubleshooting, and failure analysis (FA) during early-phase platform bring-up and validation of graphics compute hardware.
  • DFX & Execution Governance: Enforce rigorous design reviews and strict compliance with DFX (Manufacturing, Assembly, Test, and Automation) standards to ensure high-yield transitions from EVT/DVT to High-Volume Manufacturing (HVM).

Qualifications:

  • Education: Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related technical discipline.
  • Experience: 8+ years of hardware design experience, with a proven track record of shipping high-performance graphics hardware, GPU motherboards, or high-density parallel compute accelerator boards.
  • Fabric & Bus Expertise: Deep, hands-on experience designing with PCIe Gen 5/6 and high-speed serdes (112G/224G PAM4 architectures). Familiarity with CXL or scalable interconnect fabrics is highly desired.
  • Advanced Power & SI/PI: Strong understanding of high-frequency PCB layout constraints, via optimization, and power delivery networks capable of handling extreme di/dt step loads inherent to dynamic graphics workloads.
  • Hardware Tooling: Proficiency with advanced EDA tools (e.g., Cadence Allegro, OrCAD) and familiarity with simulation tools for validating physical design assumptions.
  • Global Vendor Triage: Experience directing overseas ODM engineering teams through architectural definition, layout execution, and laboratory hardware triage.

Preferred Qualifications

  • Direct experience with Open Compute Project (OCP) standards or industry-standard multi-GPU form factors.
  • Familiarity with liquid cooling or advanced phase-change thermal infrastructure and its unique spatial and material constraints on physical board design.
  • Hands-on lab experience utilizing high-speed validation equipment (e.g., oscilloscopes, VNAs, BERTs) for signal and power verification on graphics hardware.

Compensation Range: $200,000-$250,000 per year (California). This range represents the anticipated base pay for this role; the final offer may vary based on qualifications, experience, and location. This role is onsite - 5 days a week.

Benefits:

  • Medical, Dental, & Vision - 100% covered premiums
  • Equity - Stock Options
  • 401(k) match
  • WFH Equipment Reimbursement


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