Title: Laser Process Technician/Engineer Location: Onsite in Redmond, WA Duration: Long-Term Contract Benefits: Employee benefits at 100% including Medical, PTO, Holiday Pay, 401K Plan and much more! Hours: Minimum 40 Hours/Week Description • You'll run laser dicing and cutting of optical substrates, wafers, and prototype assemblies to tight tolerances, working directly with engineers and scientists on research prototypes for next-generation AR/VR optics and displays. • Our facility includes CO2, UV, fiber, and ultrafast laser systems plus precision dicing saws. Responsibilities • Set up, operate, and maintain laser dicing and cutting systems for prototype fabrication • Run process recipes to spec, and help tune parameters across materials (glass, silicon, SiC, polymers, optical films) • Handle and align wafers and substrates - mounting, taping, cleaning, de-taping • Inspect and verify parts using optical microscopes and standard measurement tools; log yield and defects • Perform routine maintenance and calibration; escalate tool issues and coordinate vendor service • Keep equipment logs, process records, and consumables inventory current • Follow all laser safety, EHS, and facility protocols, and keep the work cell clean and organized Compensation offered will be determined by factors such as location, level, job-related knowledge, skills, and experience. Range $60/hr - $70/hr