Cisco

Integrated Photonics Technical Leader - Acacia (Hybrid)

Cisco$171K — $245K *
Telecommunications & Hardware
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's + 8 years, Master's + 6 years, or PhD + 3 years in a related field or equivalent experience.
  • Proficient in solid-state physics, integrated photonics, and optoelectronics.
  • Capable of applying numerical methods for photonic-device simulation.
  • Familiar with simulation tools like FDTD, HFSS, and COMSOL Multiphysics.
  • Knowledgeable of photonic-device fabrication and its impact on performance.
  • Experienced in photonic-device layout and GDS generation.

Responsibilities

  • Design integrated photonic components and circuits for optical communication.
  • Develop numerical models using various simulation methods.
  • Create GDS layouts for photonic components and circuits.
  • Support design reviews and foundry process development.
  • Conduct hands-on characterization of photonic circuits at different levels.
  • Analyze data to correlate experimental results with models and performance.
  • Collaborate with teams to transition designs to commercial products.

Benefits

  • Hybrid work model with three days in-office per week.
  • Exposure to the complete PIC development cycle from concepts to production.
  • Collaboration opportunities with diverse engineering teams.
  • Support for professional growth and technical skill development.
Full Job Description
Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

This is a hybrid role with three days per week at our Holmdel, NJ office.

Your Impact
As a member of the PIC team, you will design, simulate, lay out, and characterize integrated photonic components and circuits for high-speed optical communication systems.
You will collaborate closely with engineers working in silicon photonics, TFLN, and III-V technologies. Your responsibilities will span numerical modeling, foundry process development, production tapeouts, PIC characterization, failure analysis, design improvement, and production support.
This role provides exposure to the complete commercial PIC development cycle-from device concepts and first prototypes to product qualification and high-volume manufacturing. You will also collaborate with millimeter-wave circuit designers, packaging engineers, module hardware and software teams, and optical test engineers to develop complete optical communication products.
  • Design passive and active integrated photonic components and circuits, including high-speed optoelectronic devices.
  • Develop and validate numerical models using electromagnetic, optical, electrical, thermal, and multiphysics simulation methods.
  • Create parameterized and script-based GDS layouts for photonic components, integrated circuits, and full product chips.
  • Support photonic design reviews, foundry process development, mask preparation, design-rule verification, and production tapeouts.
  • Plan and perform hands-on characterization of photonic components and circuits at the die, wafer, and assembled-device levels.
  • Analyze measurement data and correlate experimental results with device models, process variations, packaging effects, and system-level performance.
  • Work with cross-functional teams to transition PIC designs from prototype development into qualified commercial products.
  • Provide technical support during product integration, qualification, manufacturing ramp, and volume production.
Minimum Qualifications:
  • Bachelors + 8 years of related experience, or Masters + 6 years of related experience, or PhD + 3 years of related work experience, or equivalent related work experience.
  • Experience in solid-state physics, integrated photonics, optoelectronics, and electromagnetic theory.
  • Experience with the principles and practical application of numerical methods for photonic-device simulation.
  • Experience using simulation tools such as FDTD, HFSS, COMSOL Multiphysics, or equivalent electromagnetic and multiphysics platforms.
  • Experience with photonic-device fabrication processes and the relationship between fabrication tolerances and device performance.
  • Experience with photonic-device layout, GDS generation, design-rule compliance, and tapeout.
Preferred Qualifications:
  • PhD with at least 5 years of relevant industry or applied research experience.
  • Experience executing large-scale photonic integrated circuit tapeouts through commercial foundries.
  • Experience designing and testing PICs for optical transceivers or high-speed optical interconnect systems.
  • Experience designing, simulating, and characterizing high-speed optical modulators, photodetectors, or related optoelectronic devices.
  • Experience with high-speed electronic-photonic co-design, including the interaction among device bandwidth, impedance, parasitics, packaging, and signal integrity.
  • Experience integrating multiple material platforms, including silicon photonics, TFLN, III-V semiconductors, or other hybrid photonic technologies.
  • Hands-on experience with optical component characterization, including wafer-level and die-level testing.
  • Experience analyzing device yield, process variation, reliability, and manufacturing-test data.
  • Experience with scripting or programming languages used for simulation automation, layout generation, test automation, and data analysis.


About Cisco

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Size
79,500 employees
Market Cap
$194.5 billion
Industry
Net Income
$10.1 billion
Founded
2014
5 Year Trend
+1.4%
Revenue
$48 billion
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