HVM Field Process Engineer - PEALD, PECVD

ASM International$90K — $130K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Master's or PhD in Chemical Engineering, Materials Science, Physics, or Electrical Engineering.
  • Experience with ASM XP8-DCM/QCM process tool and/or Plasma etch process.
  • Broad technical knowledge in Semiconductor / Capital Equipment industry.
  • Proven experience in high-volume manufacturing (HVM) environments, preferably with ASM equipment.
  • Strong background in structured problem analysis and advanced troubleshooting methodologies.

Responsibilities

  • Lead on-site process qualification and optimization for tool installations.
  • Ensure adherence to customer specifications, timelines, and budget targets.
  • Design and execute experiments to enhance film quality and throughput.
  • Conduct thorough troubleshooting and root cause analyses for process issues.
  • Collaborate with customer teams to drive improvements and tool matching.
  • Document and disseminate insights from experiences across global accounts.

Benefits

  • Commitment to diversity, inclusion, and sustainability in the workplace.
  • Opportunities for professional development through growth programs.
  • Supportive and collaborative culture within a multi-national team.
  • Proactive involvement in next-generation semiconductor technology innovations.
Full Job Description
As a Field Process Engineer supporting PEALD Plasma-enhanced Atomic Layer Deposition (PEALD) and Plasma-enhanced Chemical Vapor Deposition (PECVD) on ASM's XP8 DCM/QCM platforms, you will act as the on-site process expert at customer HVM fabs. You will optimize deposition processes, resolve technical issues, and ensure tool performance meets customer and ASM requirements. This role is ideal for engineers who enjoy hands-on problem-solving, fast-paced environments, and contributing to next-generation semiconductor manufacturing.
Key Responsibilities
  • Lead process qualification and optimization during tool installs and ramp-up.
  • Execute structured DOEs to improve film quality, uniformity, and throughput.
  • Troubleshoot process issues using systematic root-cause analysis.
  • Partner with customer and ASM teams to drive continuous improvement and tool-to-tool matching.
  • Document findings and share learnings across global teams.
Customer Engagement
  • Build strong, trust-based technical relationships with customer engineers.
  • Anticipate needs and provide sustainable, long-term solutions.
  • Support escalations with clear communication and action plans.
  • Represent ASM with professionalism and technical credibility.
What Makes You Successful
  • Clear communication, strong troubleshooting methodology, and ability to stay composed under pressure.
  • Highly collaborative, organized, and proactive in solving issues and driving improvements.
  • Adaptable to changing priorities in a high-volume manufacturing environment.
Qualifications
  • Master's or PhD in Chemical Engineering, Materials Science, Physics, Electrical Engineering, or related fields.
  • Experience with deposition processes (PEALD/PECVD), vacuum systems, metrology, and semiconductor manufacturing-preferably HVM and ASM tools.
  • Strong DOE and experimental analysis skills.
  • Ability to travel up to 25%; escalations may require extended hours/weekends.
  • Strong understanding of IP boundaries and confidentiality requirements


Apply today to be part of what's next.

About ASM International

ASM International is a materials science company that provides solutions for the production of advanced materials. The company was founded in 1913 and is headquartered in Phoenix, Arizona. ASM International offers a range of products and services, including materials testing, analysis, and consulting. The company serves a variety of industries, including aerospace, automotive, and electronics. ASM International has operations in Europe, Asia, and North America.
Learn more about ASM International
Size
3,312 employees
Industry
NASDAQ

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