Avient

Global ADTS Leader, High-Performance Computing

Avient • $150K — $180K *
Avon Lake, OH 44012In-Person
Technical Services
11 - 15 years of experience
Today
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Job Overview by Ladders

Qualifications

  • Bachelor's in Engineering, Physics, Materials Science, Electrical Engineering, Photonics, or Optics; Master's or Ph.D. preferred.
  • 15+ years in product development, technology leadership, R&D, or engineering management.
  • History of commercializing innovative products for data centers or telecommunication markets.
  • Experience in leading cross-functional global teams.
  • Expertise in high-speed interconnect technologies and connectivity systems.
  • Familiar with simulation, modeling, testing of advanced connectivity systems.
  • Knowledge of data center architectures and AI infrastructure.

Responsibilities

  • Lead development of product roadmaps for data center and AI applications.
  • Establish internal capabilities and partnerships in high-speed signal transmission.
  • Partner with HPC customers to identify needs and develop product solutions.
  • Engage with customers and industry organizations on technical activities.
  • Collaborate with scientists and engineers on product innovation.
  • Work with commercial teams to find growth opportunities in related markets.
  • Support intellectual property development through disclosures and patents.

Benefits

  • Collaborative work environment with a focus on innovation.
  • Opportunities for professional growth and development.
  • Engagement with cutting-edge technologies in HPC and data centers.
  • International travel opportunities.
  • Flexible work arrangements available where applicable.
Full Job Description
Job Description

Supporting the Specialty Engineered Materials (SEM) business within Avient, the Global ADTS Leader, High Performance Computing (HPC) is responsible for leading the global technology strategy and application development efforts focused on HPC applications, including high-speed connectors, fiber optic cables, power cables, and cooling solutions for data centers and broadband networks (including 5G). The successful candidate will combine deep technical expertise in interconnect technologies, signal integrity, and advanced materials with strong leadership capabilities to drive business growth through innovation. The role requires close collaboration with customers and internal stakeholders to develop differentiated solutions that enable profitable business growth.

Responsibilities

Essential Duties & Responsibilities
  • Lead the development and execution of Avient product roadmaps supporting data center and AI infrastructure applications.
  • Establish and expand internal capabilities and external partnerships related to high-speed signal transmission, interconnect design, simulation, testing, and validation.
  • Partner with strategic HPC customers to identify unmet needs and translate requirements into differentiated product solutions.
  • Lead technical engagement activities with customers, industry organizations, technical forums, and external partners.
  • Collaborate with a global team of scientists, engineers, and technical specialists focused on innovation and product development.
  • Work closely with commercial teams to identify growth opportunities in data centers, AI infrastructure, networking, telecommunications, and adjacent markets.
  • Support intellectual property development through invention disclosures, patent generation, and technology differentiation.
  • Travel domestically and internationally as required (approximately 20%-30%).
  • Perform other duties as assigned.


Qualifications

  • Bachelor's degree in Engineering, Physics, Materials Science, Electrical Engineering, Photonics, Optics, or a related technical field required. Master's degree or Ph.D. preferred.
  • 15+ years of progressive experience in product development, technology leadership, R&D, or engineering management.
  • Proven track record of commercializing innovative products and technologies for data center, networking, telecommunications, electronics, or related markets.
  • Demonstrated experience leading cross-functional and global teams, with a proven ability to translate customer needs into commercially successful products and growth opportunities.
  • Strong understanding of high-speed interconnect technologies and connectivity systems.
  • Experience with simulation, modeling, testing, and validation of advanced connectivity systems.
  • Familiarity with data center architectures, AI infrastructure, storage systems, networking equipment, and telecommunications systems.
  • Experience developing intellectual property portfolios and technology roadmaps.
  • Participation in industry standards organizations or technical committees preferred.
  • Experience establishing or expanding laboratory, testing, simulation, or product development capabilities.
  • Excellent communication, presentation, and customer engagement skills.


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About Avient

Avient Corporation is a leading provider of specialized polymer materials, services, and solutions. The company operates in more than 50 countries and serves a wide range of industries, including packaging, healthcare, transportation, electronics, and construction. Avient's product portfolio includes thermoplastic elastomers, color and additive concentrates, specialty compounds, and more. The company was founded in 1888 and is headquartered in Avon Lake, Ohio.
Learn more about Avient
Size
8,700 employees
Market Cap
$3 billion
Industry
Manufacturing & Automotive
Net Income
$131.6 million
5 Year Trend
+10.4%
Revenue
$3.2 billion
NASDAQ
AVNT
* Ladders Estimates

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