Failure Analysis Engineer

Applied Optoelectronics, Inc.

$95K — $115K *
Manufacturing & Automotive
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • 1-3+ years hands-on experience with Transmission Electron Microscopy (TEM) and Focused Ion Beam (FIB) techniques.
  • Master's degree or Ph.D. in Material Science Engineering, Electrical Engineering, Physics, or related field with 1 year of semiconductor lab experience preferred.
  • Familiarity with compound semiconductor device theory is a plus.
  • Preferred programming skills in Microsoft Access, SQL, LabVIEW.
  • Experience with Design of Experiments (DOE) techniques and Statistical Process Control (SPC) methodologies.

Responsibilities

  • Conduct internal failure analysis using device decap, microscopic, and SEM inspection.
  • Perform sample preparation and imaging utilizing FIB and high-resolution STEM to detect atomic-level defects.
  • Execute root cause analysis on structural, electrical, and physical defects in semiconductor devices.
  • Characterize materials with Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analysis methods (SIMS, XPS).
  • Document technical findings and present data to cross-functional teams while supporting improvement projects.
  • Maintain high uptime of TEM/FIB equipment through calibration and troubleshooting.

Benefits

  • Collaborative work environment with cross-functional team interaction.
  • Opportunities for professional growth and continuous improvement initiatives.
  • Exposure to advanced semiconductor technologies and cutting-edge analysis techniques.
Full Job Description
Summary

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

Job Duties

  1. Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.
  2. Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.
  3. Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.
  4. Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.
  5. Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.
  6. Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.


Qualifications

  1. Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 1• 3+ years).
  2. Master's degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.
  3. Knowledge of compound semiconductor device theory is desired.
  4. Microsoft Access, SQL, LabVIEW and other programing skills preferred.
  5. Experience with DOE techniques and SPC (Statistical Process Control) is preferred.
  6. Strong data analysis and problem solving skills.
  7. Detail oriented and self-motivated.
  8. Ability to work independently and as a team.
  9. Ability to work in clean room environment wearing smock
  10. Excellent interpersonal and communication skills for successful inter and intra-group interactions.


Physical Demands and Work Environment

  1. Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.
  2. The associate work in a manufacturing environment and be require to wear personal protective equipment.

Location

This position will be on-site based in Sugar Land, Texas.

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