Allegro MicroSystems

Failure Analysis Engineer

Allegro MicroSystems$90K — $120K *
Consumer Technology
Less than 5 years of experience
Job Overview by Ladders

Qualifications

  • Bachelor's or Master’s degree in Electrical Engineering or Computer Engineering
  • Understanding of semiconductor device physics and IC fabrication
  • Excellent problem-solving skills
  • Ability to interpret complex electrical schematics
  • Strong written and verbal communication skills
  • Ability to work independently and in a team environment

Responsibilities

  • Perform manual probing and electrical fault isolation on wafers and packaged parts
  • Utilize electrical characterization tools to detect anomalies
  • Conduct physical analysis through mechanical polishing and wet chemical etching
  • Employ advanced failure analysis techniques like SEM/EDX and FIB
  • Analyze wafer-level yield issues and support technology development
  • Investigate reliability failures and understand degradation mechanisms
  • Document findings and collaborate with cross-functional teams

Benefits

  • Hands-on experience in a specialized lab environment
  • Opportunity to work with advanced analytical techniques
  • Collaboration with leading technology development teams
  • Involvement in cutting-edge semiconductor projects
  • Potential for professional growth in failure analysis techniques
Full Job Description

The Opportunity

The Failure Analysis Engineer position is a highly hands-on role dedicated to performing in-depth analysis of semiconductor integrated circuits (ICs) failures. This position is primarily based in the Failure Analysis lab, with the majority of the work involving direct lab activity. The role focuses on identifying root causes for yield excursions, new technology development issues, and reliability failures. The successful candidate will utilize precision electrical characterization tools and physical analysis techniques to determine failure mechanism and assist in root cause analysis.

What You Will Do

  • Electrical Characterization (80% of Role): Perform extensive manual probing and electrical fault isolation on wafers and packaged parts. Utilize Source Measure Units (SMUs), oscilloscopes, and curve tracers to characterize electrical signatures and pinpoint anomalies.

  • Physical Analysis (20% of Role): Perform targeted physical deconstruction, including mechanical polishing/grinding for cross-sections and the use of wet chemical etching and decapsulation to correlate electrical findings with physical defects.

  • Advance FA techniques: Utilize advanced failure analysis techniques such as optical microscopy, SEM/EDX, FIB, OBIRCH, PEM and IR microscopy.

  • Yield & Tech Development Support: Conduct in-depth analysis on wafer-level issues to identify process-related yield issues. Work closely with the technology development team to analyze failures in next-generation silicon processes.

  • Reliability Analysis: Analyze devices that have failed during stress testing (REL) to understand degradation mechanisms and long-term stability.

  • Collaboration & Reporting: Document findings in detailed technical reports and collaborate with Process, Design, and Yield Enhancement (DYE) teams to drive corrective actions.

What You Will Need

  • Bachelor's or Master’s degree in Electrical Engineering or Computer Engineering is required.

  • Understanding of semiconductor device physics, IC fabrication processes, and packaging technologies.

  • Excellent problem-solving skills and a methodical approach to root cause analysis.

  • Ability to interpret complex electrical schematics and layouts.

  • Strong written and verbal communication skills, with the ability to present technical information effectively.

  • Ability to work independently and as part of a team in a fast-paced environment.

Preferred Qualifications:

  • Familiarity with statistical analysis tools and methodologies for data interpretation.

  • Experience with programming or scripting for automation of analysis tasks.

  • Knowledge of reliability testing standards (e.g., AEC-Q100, JEDEC) and failure analysis techniques and equipment is a plus.

  • Experience with Allegro's specific product lines (e.g., magnetic sensors, power management ICs, motor drivers) is a plus.

About Allegro MicroSystems

Allegro MicroSystems is a leading global designer, developer, fabless manufacturer, and marketer of sensor integrated circuits (ICs) and application-specific analog power ICs enabling emerging technologies and powering the world’s most innovative products. The company’s diverse product portfolio provides efficient and reliable solutions for the automotive, communications, computing, consumer, industrial, LED lighting, medical, and power management markets. Allegro’s headquarters are in Manchester, New Hampshire (USA) with design, applications, and sales support centers located worldwide. The company is ISO 9001:2015 certified and has been publicly traded on the NASDAQ Stock Market since 2019.
Learn more about Allegro MicroSystems
Size
3,000 employees
Market Cap
$5.6 billion
Industry
5 Year Trend
+21.9%
NASDAQ

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