- Explore 2.5D/3D integration, wafer-level packaging, diverse interposers, and embedded passives.
- Study low-loss die-to-die and die-to-package interfaces, including micro-bumps, vias, and waveguide structures.
- Develop embedded shielding, isolation structures, and localized cooling for high-power RF arrays.
- Investigate additively manufactured RF structures and engineered materials for prototyping advantages.
- Perform full-wave EM simulations to quantify interconnect loss, leakage, coupling, and noise.
- Design package transitions, antenna feeds, and grounding networks across die, substrate, and board boundaries.
- Coordinate VNA, thermal, and OTA array measurements to evaluate system-level package performance.
- Partner with internal specialists (RFIC, antenna, materials, manufacturing) to frame cross-disciplinary research.
- Secure patents and invention disclosures while publishing papers and internal technical reports.
The
total target annual compensation for this position ranges from $106,000 to $156,000 depending on education, experience, and demonstrated expertise.
- 5 years of relevant industry experiences.
- PhD in Electrical Engineering, RF/Microwave Engineering, Packaging, or a related field (or equivalent advanced R&D experience).
- Deep knowledge of RF/microwave principles.
- Experience using full-wave EM and circuit simulation tools to model packages and correlate results with measure.
- Hands-on experience designing test vehicles and directing microelectronics assembly (e.g., PCB, flip-chip, wire bonding, SMT, molding).
- Proficiency with RF lab equipment (VNAs), probe station.
- Working knowledge of thermal management, CTE mismatch, stress, warpage, and reliability testing.
