Job DescriptionWe are seeking a Focal Plane Packaging Engineer to help create the "eyes" of the next generation of space payloads by developing and building state-of-the-art electro-optical (EO) focal plane subsystems for space-based applications. In this role, you will execute advanced, precision assembly and microelectronic packaging processes for focal planes that operate at the intersection of optical physics, advanced materials science, high-speed electronics, and cryogenic thermal management. Success requires cross-disciplinary integration across mechanical, thermal, electrical, and optical interfaces, as well as rigorous adherence to quality and configuration-control standards. The selected candidate will work in a highly controlled cleanroom environment to manufacture space-flight hardware and contribute directly to mission-critical capabilities across Civil, Defense, and Tactical space programs.
This position is for a Focal Plane Packaging Engineer and will report to the Detector Technology Center of the Payload Engineering department within the Engineering, Science and Analysis (ESA) Strategic Capabilities Unit of BAE Systems Space & Missions Systems (SMS).
The Engineering, Science and Analysis (ESA) Strategic Capabilities Unit comprises the technical talent and organizational leadership that enables the successful delivery of high-impact discriminating technologies for our customers' missions. Our collaborative, cross-functional teams are committed to innovation, integrity, continual learning and strong execution.
What You'll Do:
- Collaborate with multidisciplinary engineering teams to design and implement packaging concepts incorporating mechanical, thermal, electrical, and optical requirements.
- Develop focal-plane packaging strategies and hands-on assembly processes enabling focal plane arrays across the electromagnetic spectrum (UV, Visible, NIR, SWIR, MWIR, and LWIR) for space-based platforms.
- Create, update, and maintain detailed process documentation, including ensuring full configuration control of processes and associated records.
- Conduct manufacturing readiness reviews to demonstrate process maturity, quality assurance compliance, and adherence to configuration-controlled practices.
- Manufacture space-flight focal planes in a Class 100 cleanroom environment using electrostatic-controlled work practices, maintaining thorough build documentation throughout all assembly steps.
- Maintain a regular and predictable work schedule.
- Establish and maintain effective working relationships within the department, the Strategic Business Units, Strategic Capabilities Units and the Company. Interact appropriately with others in order to maintain a positive and productive work environment.
- Perform other duties as necessary.
On-Site Work Environment: This position requires regular in-person engagement by working
on-site five days each normally scheduled week in the primary work location. Travel and local commute between company campuses and other possible non-company locations may be required.
Working Conditions: - Work is performed in an office, laboratory, production floor, or cleanroom, outdoors or remote research environment.
- May occasionally work in production work centers where use of protective equipment and gear is required.
- May access other facilities in various weather conditions.
Required Skills and Education- BS degree or higher in Engineering or a related field is required plus 4 or more years related experience.
- Each higher-level related degree, i.e., Master's Degree or Ph.D., may substitute for two years of related experience. Related technical experience may be considered in lieu of education. Degree must be from a university, college, or school which is accredited by an agency recognized by the US Secretary of Education, US Department of Education.
- Ability to work hands-on with sensitive components in a cleanroom environment.
- Strong documentation, process development, and configuration-control skills.
- Effective communication and collaboration skills within multidisciplinary teams.
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A security clearance or access with Polygraph is not required to be eligible for this position. However, the applicant must be willing and eligible for submission, depending on program requirements, after an offer is accepted and must be able to maintain the applicable clearance/access.
Preferred Skills and Education- Experience with mechanical packaging of detectors (or similar microelectronics) and associated thermal and contamination constraints.
- Knowledge of microelectronic packaging of focal plane arrays or related products
- Knowledge of die attach and adhesive technology; interconnect technologies including wire bonding, soldering and flip chip hybridization; cleaning techniques such as vacuum bake, plasma etch, and liquid chemical processes; precision alignment; thin film deposition; thermal control and structural designs.
- Knowledge of assembly protocols in Class 100 cleanroom and contamination mitigation.
This position will be posted for at least 5 calendar days. The posting will remain active until the position is filled, or a qualified pool of candidates is identified.
Multiple positions may be available on this opening.
