Position Summary: We are looking for a hardworking and passionate Electroplating Process Development Engineer for our Florida Advanced Packaging site working with copper, nickel, SnAg and gold plating. In this role you will develop and improve processes for integrated Advanced Packaging process flows and Heterogenous Integration (HI) platform technologies such as Hybrid Bonding and Direct Bond Interconnect (DBI), 2.5D and 3D Interposer, and Fan-Out Wafer Level Packaging (FOWLP). Excellent oral and written communication skills are required to effectively and efficiently communicate ideas with foundry customers, colleagues, and management.
Major Area of Accountability: • Own overall responsibility for plating process development area, drive improvements in process, documentation, training with new process development/transfer in a manufacturing environment.
• Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans.
• Lead or work in a team for process integration of advanced packaging solutions for platform Heterogenous Integration technologies and unique customer applications.
• Utilize metrology tools to characterize and document process results for transfer to production including CVS measurements, bath analysis and additions, thickness and fill characteristics.
• Investigate and drive integration changes for improved device performance and yield improvement.
• Work with process integration and tool engineers to find processing marginalities and make improvements.
• Routinely monitor selected in-line and end-of-line SPC charts for trends or excursions that can be addressed by process changes.
• Directly interface with management as a team leader or area owner for your unit process modules.
• Could develop into a Project Management position integrating Customer device requests.
The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position.
Required Qualifications: Education:BS Engineering (8 years), MS/PhD (5 years) preferred in Physics, Electrical Engineering, Materials Science or equivalent.
Experience and Skills:
- Back-end-of-line (BEOL) or front-end-of-line (FEOL) fab processing tools knowledge/experience.
- 5-8 years of engineering experience.
- Develop or integrate robust manufacturable process recipes for Foundry customers in Copper, Nickel, Gold, or SnAg electroplating, wet etch chemistry and wet cleans.
- MEMS, Photonics, or CMOS device and integration knowledge (or similar) with relevant combination of years of experience and/or advanced degree.
- Proficient in DOE and SPC. Knowledge of 6-sigma concepts and applications.
- Project Management skills and/or defined training a plus.
- Clear problem-solving capability, data driven, inventive solution oriented and can articulate thought processes.
- Experience with customer interfacing to solve problems and transfer processes a plus.
- Can work both independently and in (or lead) cross-functional teams for problem solving.
- US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance.
The annual salary range for this role is $114,320 - $171,480. Pay offered is based on many factors including, but not limited to, the job-related experience, skills, education, and credentials of each candidate.SkyWater offers an exciting environment where the brightest semiconductor minds come together to achieve exceptional results. We offer competitive salary and an opportunity to participate in incentive plans as well other employee financial benefits including 401k match, life insurance and opportunities to purchase SkyWater stock at a discounted rate.
Additionally, SkyWater offers a comprehensive benefits package which promotes a healthy life. This includes benefit eligibility day one, medical, dental, mental health benefits, vision, legal planning, short- and long-term disability, paid time off, paid holidays, an on-site fitness facility, and an on-site self-serve market.
