Application close date:
Applications will be accepted on an ongoing basis until the requisition is closed.

This role is part of Advanced Concepts and Enterprise Engineering (ACE), supporting Blue Origin's mission of millions of people living and working in space for the benefit of Earth. The team fosters innovation and drives engineering workflows of the future, shared solutions and standards, simplicity and lower costs, and manufacturable design.

Blue Origin is seeking a highly skilled and experienced Electromagnetic Compatibility (EMC) and Electrical Bonding Engineer to join our elite team of experts on the Engineering Center of Excellence Electromagnetics team. This is a unique opportunity to make a significant impact on the future of space exploration by ensuring top-level Electromagnetic Interference (EMI), Electromagnetic Compatibility (EMC), lightning, and Radio Frequency (RF) integration and architecture for our advanced electrical and electronic systems. Your expertise will be crucial in designing and verifying electrical bonding architectures, executing rigorous EMI/EMC testing, and developing robust verification strategies to ensure safe and repeatable spaceflight of our cutting-edge aerospace systems.

As part of a small, passionate, and accomplished team of experts on the system definition and design team, you will be responsible for all levels of bonding and grounding architecture for all Blue Origin programs. You will define, document, and qualify bonding and grounding requirements for electrical, structural, and all system interfaces. You will bring deep, applied expertise in MIL-STD-461 testing methodologies, leveraging your experience across the full spectrum of conducted and radiated emissions and susceptibility test methods to characterize and validate avionics and power system hardware intended for spaceflight environments. You will also be responsible for determining fault current paths and developing design process standards to support build of the space vehicles.

Special Mentions [Edit or remove as needed]

• Relocation provided
• Travel expected up to 10% of the time
• Interviews will include a technical assessment

Responsibilities include but are not limited to:

Electrical Bonding & Grounding:

• Establish comprehensive bonding and grounding requirements for spacecraft and launch vehicles
• Author and maintain electromagnetic effects control plans with focus on electrical bonding strategies
• Develop and execute electrical bond verification test plans for critical spacecraft and launch vehicle interfaces
• Perform hands-on electrical bond verification during vehicle manufacturing
• Determine fault current paths and develop appropriate bonding solutions to mitigate risks
• Evaluate and select verification strategies for the bonding and grounding approach
• Analyze and summarize bonding test data to validate design implementations
• Support sustained work statement to ensure electrical bonding guidance is given on demand by affected business units
• Educate design teams on electromagnetic compatibility requirements with emphasis on bonding best practices
• Support Responsible Engineers in designing cost-effective bonding implementations
• Collaborate with Configuration Data Management to implement and transition to new bonding standards
• Balance EMI mitigation requirements with operational environments and design constraints

EMI/EMC Testing & Verification:

• Serve as a responsible engineer for electrical system EMI/EMC test and verification, ensuring rigorous compliance with industry standards, customer requirements, and internal guidelines, with particular emphasis on MIL-STD-461G applicability and tailoring for aerospace platforms
• Author comprehensive EMI/EMC documentation, including system test strategies, requirements decomposition, margin management plans, and design rationales, with explicit traceability to MIL-STD-461 test method requirements and limit applicability matrices
• Design, develop, and refine detailed Test Plans and Test Procedures for executing EMI/EMC tests on a wide array of avionics components and systems
• Lead execution of the complete MIL-STD-461 test suite including:
  • CE101 - Conducted Emissions, power leads, 30 Hz to 10 kHz
  • CE102 - Conducted Emissions, power leads, 10 kHz to 10 MHz
  • CS101 - Conducted Susceptibility, power leads, 30 Hz to 150 kHz
  • CS114 - Conducted Susceptibility, bulk current injection (BCI), 10 kHz to 200 MHz
  • CS115 - Conducted Susceptibility, bulk current injection, impulse excitation
  • CS116 - Conducted Susceptibility, damped sinusoid transients, 10 kHz to 100 MHz
  • RE101 - Radiated Emissions, magnetic field, 30 Hz to 100 kHz
  • RE102 - Radiated Emissions, electric field, 10 kHz to 18 GHz
  • RS101 - Radiated Susceptibility, magnetic field, 30 Hz to 100 kHz
  • RS103 - Radiated Susceptibility, electric field, 10 kHz to 40 GHz
• Operate, calibrate, and maintain sophisticated EMI/EMC test equipment including EMI receivers, signal generators, broadband power amplifiers, LISNs, current injection probes, calibrated antennas, near-field magnetic probes, and associated test fixtures
• Apply advanced knowledge of shielded room characterization, ground plane bonding techniques, and cable harness dressing in accordance with MIL-STD-461 test setup requirements
• Produce high-quality, technically rigorous test reports demonstrating EMI/EMC standard compliance, including full spectral data plots, tabulated margin results, equipment configuration photographs, calibration traceability records, test anomaly dispositions, and formal pass/fail determinations
• Troubleshoot EMI/EMC test failures and anomalies, identifying root causes and recommending effective corrective actions such as filter insertion, common-mode choke placement, shielded enclosure improvements, PCB-level layout modifications, and cable shielding enhancements

General:

• Develop innovative design solutions to address integrated system trades for EMI/EMC, lightning, ESD, bonding, and RF challenges
• Contribute to the definition, verification, and validation of vehicle, system, and component-level requirements for EMI/EMC, lightning, ESD, and RF
• Deliver high level technical presentations on bonding and EMC solutions to review boards
• Integrate technical work performed within the architecture team as well as design teams
• Implement Python tools for automation of bond test data analysis, configuration management, and reporting
• Lead and champion EMI design and system EMC engineering activities
• Conduct comprehensive risk reduction testing for EMI/EMC based on established industry standards
• Make quick decisions in fast-paced environments
• Work across different functional and design teams to find solutions
• Mentor junior engineers in electrical bonding design, EMC testing, and best practices

Minimum Qualifications

• Minimum of a B.S. degree in Electrical Engineering, Aerospace Engineering, Physics, or related technical discipline
• 7+ years industry experience in Space/Aerospace system electrical bonding design and verification
• 5+ years of hands-on experience in EMC/EMI testing and verification, with direct execution experience across all MIL-STD-461 CE, CS, RE, and RS test methods
• Proficiency in EMI test automation software, data acquisition, spectral post-processing, and limit-line comparison analysis
• Demonstrated experience leading, mentoring and managing small, creative teams on fast-paced projects
• Exceptional troubleshooting skills with proven ability to diagnose and resolve EMI issues down to the component level
• Strong interpersonal skills and ability to collaborate across multiple engineering disciplines
• Excellent technical communication skills, both written and verbal
• Ability to earn trust, maintain positive and professional relationships, and strengthen our culture of inclusion
• Willingness to support extended hours, weekend shifts, and on-call rotations during critical test campaigns
• Willingness to travel domestically and internationally to support customer test activities
• Must be a U.S. citizen or national, U.S. permanent resident (current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

Preferred Qualification

• M.S. or Ph.D. in Electrical Engineering with EMC specialization
• 10+ years industry experience in aerospace bonding, grounding, and EMC design
• Experience in the development of system engineering products such as requirements, interface control documents, and verification reports
• Experience with challenging bonding implementations such as composite structures and moving interfaces
• Experience with instrumentation pipeline architecture and sensor data management
• Background in GitLab-based configuration management for bond design documentation
• Experience with Python programming for automation of bond test data analysis and reporting
• Experience in training for electrical bonding procedures in an aerospace manufacturing setting
• Experience with IGS panel design and test sequence development

Base Pay Range for:
CA applicants is $156,802.00 - $219,522.45CO applicants is $144,179.00 - $201,849.90WA applicants is $156,802.00 - $219,522.45

Other site ranges may differ

Benefits

• Benefits include: Medical, dental, vision, basic and supplemental life insurance, paid parental leave, short and long-term disability, 401(k) with a company match of up to 5%, and an Education Support Program.
• Stock Options for all regular employees (working at least 20 hours/week)
• Paid Time Off: Up to four (4) weeks per year based on weekly scheduled hours, and up to 14 company-paid holidays.
• Dependent on role type and job level, employees may be eligible for benefits and bonuses based on the company's intent to reward individual contributions and enable them to share in the company's results, or other factors at the company's sole discretion. Bonus amounts and eligibility are not guaranteed and subject to change and cancellation. Please check with your recruiter for more details.