As Director of Package Materials Integration in Advanced Packaging Technology Development (APTD), you will lead the strategy, execution, and organizational capability for Micron's advanced packaging materials roadmap for advanced 3D memory products including HBM and 3DS DRAM. You will lead a global team with direct reports in both the U.S. and Asia and work closely with cross-functional partners across process development, process integration, equipment development, manufacturing, global quality, and purchasing. You will be responsible for setting the advanced packaging materials roadmap, driving supplier engagement to meet roadmap needs, building organizational capability across regions, leading materials aspects of program execution, and resolving critical materials-package interaction issues. Responsibilities will include, but are not limited to: - Lead the advanced packaging materials roadmap and ensure alignment with overall product roadmap timelines across multiple development programs. - Provide organizational leadership for a diverse materials portfolio that includes chemistries (plating, cleaning, etc.), photoresists, films (dicing tapes, temporary bond films, etc.), polymer composites (NCF, mold compound, etc.), and carrier materials (glass, silicon, etc.). - Lead supplier engagement at executive and engineering levels to prototype, develop, and certify materials in alignment with program requirements, timelines, and long-range roadmap needs. - Build and lead a high-performing global team with direct reports in both the U.S. and Asia, establishing clear priorities, talent development plans, and strong execution disciplines. - Partner with process engineering, equipment development, and process integration leaders to ensure all TD deliverables are met and that regional teams operate with aligned priorities and decision-making. - Drive materials characterization strategies to understand materials-package interaction mechanisms using analytical, mechanical, and thermal testing and analysis, and translate findings into development and product decisions. - Lead development of novel materials solutions in conjunction with advanced packaging and product teams to recommend optimum package solutions that meet electrical, mechanical, thermal, reliability, cost, and system-level requirements. - Interface closely with Product Development, frontend Si TD, APTD, Manufacturing, and Global Quality to lead the product/package path from pathfinding through development and into high-volume manufacturing. Successful candidates for this position will have: - Demonstrated success leading technical organizations with a strong foundation in structured problem solving. - Experience and working knowledge with 2.5D/3D heterogeneous integration technologies such as WLFO, SoIC, CoWoS, WoW, InFO, and other chiplet/SiP architectures. - Experience and working knowledge with materials used throughout the advanced packaging flow. - Understanding of and experience working with materials suppliers in the advanced packaging supply chain/ecosystem. - Working knowledge of materials characterization techniques and simulation (thermal/mechanical/electrical) methodologies. - Knowledge in materials-package interactions. - Experience with wafer bumping, package assembly, substrate technology, BOM selection, testing and product development lifecycle. - Excellent communication skills with the ability to convey complex technical concepts to both technical and non-technical stakeholders. - Proven people leadership with experience managing managers and/or senior technical leaders across geographies, including direct reports in both the U.S. and Asia. - Demonstrated ability to set organizational direction, develop talent, and drive technical excellence through cross-functional and cross-regional teams. Required Experience: - Master of Science/PhD in chemistry, chemical engineering, or materials science and engineering. PhD preferred. - 15+ years of relevant experience in semiconductor manufacturing or a related field, including hands-on experience in semiconductor advanced packaging. - 10+ years of management/leadership experience in packaging technology development, including responsibility for leading global teams and driving execution across regions. - Strong understanding of semiconductor process integration and process development. - Proven program and organizational leadership skills, with experience driving cross-functional technical teams, influencing executive stakeholders, and delivering results through others. - Experience with advanced memory packaging is a plus. As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.