Amkor Technology

Director, Chiplets/FCBGA BU

Amkor Technology • $130K — $180K *
Tempe, AZ 85281In-Person
Manufacturing & Automotive
8 - 10 years of experience
Reposted 4 days ago
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Job Overview by Ladders

Qualifications

  • Bachelor's degree in Engineering; Master's is a plus.
  • 10+ years of industry experience in semiconductor packaging.
  • Experience with Design of Experiments and Statistical Process Control.
  • Previous project management experience necessary.
  • Strong understanding of wafer bump and assembly processes.
  • Knowledge of cost modeling and pricing activities needed.
  • Ability to manage multiple programs simultaneously.

Responsibilities

  • Partner with BU members to achieve market share growth through customer management.
  • Promote Amkor packaging technologies to identify potential applications.
  • Collaborate with customer teams to meet assembly and reliability needs for new products.
  • Conduct risk assessments for manufacturability and reliability of new products.
  • Assist in prototype builds and ensure successful qualifications and production ramps.
  • Maintain detailed cost analysis and provide pricing inputs to management.
  • Support the transfer of new packaging technologies to production.

Benefits

  • Hybrid work schedule with flexible options.
  • Opportunity to work in the dynamic semiconductor industry.
  • Possibility of career growth through diverse project involvement.
  • Collaboration with both internal teams and external customers.
Full Job Description
Position Summary:

Amkor is recruiting for a Business Unit (BU) Product Management position for Advanced Chiplets/FCBGA Packaging in Tempe, AZ, where the primary function of this position is program management and to manage key customer accounts. Additionally, the position will drive internal process development and co-development programs in support of customers, off-shore factories and supplier development teams while supporting the qualification and mass production of Chiplets/FCBGA products. This individual will manage multiple day-to-day activities through internal management systems, as well as support existing customers.

Essential Duties and Responsibilities:
  • Partner with BU members to achieve annual goals, while managing customer relationships to grow market share.
  • Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
  • Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions. To include: substrate design, silicon to package interconnects, product assembly material selections, and manufacturing process requirements.
  • Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
  • Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps. This will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution.
  • Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs.
  • Work with Amkor advanced product development teams on the transfer of new packaging technologies to production. This will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.
  • Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.


Required Qualifications:
  • This position requires a Bachelor's degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines). Master's degree is a plus.
  • 10+ years of demonstrated industry experience required, with semiconductor packaging experience required.
  • Experience with Design of Experiments and Statistical Process Control is needed.
  • Previous project management experience is a required.
  • Knowledge of material and package characterization data analysis, test methods and qualification procedures are required.
  • Strong understanding of wafer bump, fanout, assembly processes and techniques is necessary.
  • Experience with cost modeling, pricing, quoting activities and products is needed.
  • Proven ability to multiplex across numerous programs and teams is essential. Experience working with offshore factories is a plus.
  • Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment.
  • Ability to work independently in a heavily matrixed organization.
  • Requires excellent, demonstrated written and verbal communication skills.
  • Ability to work independently, solve problems, resolve barriers to success is a must.
  • Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required.
  • This position can require up to 10% travel.


Preferred Qualifications:
  • Flip Chip package design and OSAT experience will be a plus.
  • Experience working with external customers is highly preferred.


Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

About Amkor Technology

Amkor Technology is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania, United States. The company was founded in 1968 and has more than 30,000 employees worldwide and a reported $4.2 billion in revenue for 2018. Amkor Technology is one of the world's largest providers of outsourced semiconductor packaging and test services. The company offers semiconductor design, wafer fabrication, assembly and test services. Amkor's operational base includes production facilities, product development centers, and sales and support offices located in Asia, Europe and the United States. The company's customers include integrated device manufacturers, fabless semiconductor companies and contract foundries. Amkor Technology was founded in 1968 and became a public company in 1998.
Learn more about Amkor Technology
Size
30,400 employees
Market Cap
$5.9 billion
Industry
Manufacturing & Automotive
Net Income
$338.1 million
Founded
1968
5 Year Trend
+9.3%
Revenue
$5 billion
NASDAQ
AMKR
* Ladders Estimates

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