BAE Systems

Dir II- Eng

BAE Systems • $150K — $180K *
Nashua, NH 03060In-Person
Aerospace & Defense
11 - 15 years of experience
Today
Be an Early Applicant
Job Overview by Ladders

Qualifications

  • Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field
  • 15+ years in microelectronics with 10+ years in wafer fab and packaging operations
  • U.S. citizenship with eligibility for Secret security clearance
  • Proven experience leading organizations of engineers and technicians
  • Demonstrated success in managing and executing complex projects
  • Exceptional communication and collaboration skills
  • Passion for mentoring and developing talent

Responsibilities

  • Lead and mentor a high-performing team of engineers in wafer fabrication
  • Drive innovation across the full lifecycle of microelectronics component development
  • Collaborate with Business Area leadership to keep projects on track
  • Develop a microelectronics capability roadmap for future success
  • Establish and maintain best-in-class operating policies
  • Drive budget and resource planning with key performance indicators
  • Identify improvements to optimize operations and reduce costs

Benefits

  • Focused on team safety and a high-quality work environment
  • Emphasizes innovation and continuous improvement culture
  • High-visibility role within a significant portfolio of $100M+ annually
  • Opportunities for professional development and growth
  • Engagement with leading experts and strategic business partners
Full Job Description
Job Description

About the role
BAE Systems is seeking a Deputy Director to lead microelectronics engineering and foundry operations for a high-visibility portfolio. You will steer strategy, execution, and continuous improvement across design, fabrication, packaging, and production for programs totaling $100M+ annually.

What you'll do:
  • Lead & Grow a High-Performing Team: Direct and mentor a team of skilled engineers and manufacturing professionals operating our 6-inch (150mm) wafer fabrication facility. Focus on creating a safe, high-quality environment where innovation thrives.
  • Drive Innovation from Design to Production: Lead the full lifecycle of microelectronics component development - from initial design and fabrication through packaging and into large-scale production for both development and deployed programs.
  • Be a Strategic Partner: Collaborate closely with Business Area leadership, providing critical insights and ensuring projects stay on schedule, within budget, and meet stringent performance requirements.
  • Chart the Course for Future Success: Develop and champion a sector-level microelectronics capability roadmap, leveraging both internal expertise and insights from external leaders in the field.
  • Ensure Operational Excellence: Establish and maintain best-in-class operating policies and procedures, aligned with company standards and regulatory compliance.
  • Manage & Optimize: Drive budget and resource planning, setting key performance indicators (KPIs) for financial performance, staffing, yield, quality, and delivery. Identify and implement improvements to optimize operations, reduce costs, and accelerate production timelines.

What you'll bring:
  • Proven Leadership: A demonstrated track record of successfully operating and managing advanced semiconductor chip manufacturing facilities in a production environment.
  • Technical Expertise: Deep understanding of advanced process technologies, particularly within GaAs/GaN fabrication.
  • Strategic Thinking: Ability to synthesize complex information, develop forward-looking roadmaps, and translate strategy into actionable plans.
  • Problem-Solving Skills: Ability to analyze complex challenges, develop creative solutions, and implement effective strategies.
  • Strong Communication Skills: Ability to effectively communicate with both technical and non-technical audiences, including senior leadership.
  • Results-Oriented: A proven ability to deliver results in a fast-paced, demanding environment.
  • Growth Mindset: A commitment to continuous learning, embracing new technologies, and fostering a culture of innovation within the team.


Required Skills and Education

  • Bachelor's degree in Electrical Engineering, Materials Science, Physics, or related field; 15+ years in microelectronics with 10+ years leading wafer fab and packaging operations.
  • U.S. citizenship with eligibility to obtain a Secret security clearance.
  • Proven experience leading large organizations of engineers, technicians, and program staff.
  • Demonstrated success planning, managing, and executing complex projects.
  • Exceptional communication, collaboration, and stakeholder management skills.
  • Passion for mentoring mid- to late-career team members; proven talent development results.


Preferred Skills and Education

  • Director-level leadership in microelectronics (commercial or defense), especially in III-V technologies (GaAs/GaN), RF/MMIC, advanced packaging, and high-reliability manufacturing.

About BAE Systems

BAE Systems plc is a British multinational arms, security, and aerospace company. It is among the world's largest defense contractors, with over 85,000 employees and operations in over 40 countries. BAE Systems is involved in the design, development, and manufacture of a wide range of products and services, including military aircraft, naval ships, and land vehicles. The company also provides a range of cybersecurity and intelligence services. BAE Systems has a long history, dating back to the 19th century, and has been involved in many major defense projects. Visit baesystems.com for more information.
Learn more about BAE Systems
Size
90,500 employees
Industry
Aerospace & Defense
Founded
1997
NASDAQ
BAESF
* Ladders Estimates

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