Design for Test (DFT) Engineer

DensityAI

$300K — $350K *
Consumer Technology
5 - 7 years of experience
Job Overview by Ladders

Qualifications

  • BS/MS in Electrical Engineering, Computer Engineering, or related field.
  • 7+ years of hands-on DFT engineering on complex digital SoC/ASIC designs.
  • Broad expertise across all DFT domains: architecture, insertion, ATPG, BIST, boundary scan, verification, and silicon test.
  • Experience in developing, automating, and maintaining DFT flows.
  • Hands-on experience in hierarchical/core-wrapping DFT.
  • In-depth knowledge of multi-die/advanced package DFT strategies, including post-package scan access and test-access architecture.
  • Strong proficiency in Siemens Tessent tools and deep understanding of DFT fundamentals.

Responsibilities

  • Advance the DFT flow integrated into the broader RTL-to-GDSII methodology.
  • Architect and implement test access for multi-die packages, focusing on a robust design from inception.
  • Implement DFT structures including various scan techniques and boundary scan protocols.
  • Drive ATPG, fault simulation, and pattern conversion for ATE environments.
  • Perform integrity checks and simulations for verification of DFT practices across test modes.
  • Define and review specifications, budgets, and architecture for DFT implementations.
  • Support silicon bring-up, debugging, yield analysis, and ensure results correlate with design.

Benefits

  • Medical, dental, and vision coverage.
  • 401(k) retirement plan.
  • Standard paid time off (PTO).
  • Equity grant opportunities as per company guidelines.
  • Visa sponsorship available for qualified candidates.
Full Job Description
About the Role

We are seeking an experienced Design-for-Test (DFT) Engineer to join our silicon engineering team and help stand up the DFT function alongside the architecture and physical-design (PD) teams. This is a ground-floor role on a leading-edge multi-die package. You will work across all aspects of the DFT discipline-from architecture and RTL insertion through pattern generation, verification, silicon bring-up, and production test-with a particular focus on solving test access for a multi-die package from the ground up. You will partner with design, verification, physical design, and product/test engineering to help deliver high-quality, testable, and yield-ready silicon.
What you'll do:
  • Help build out and advance the DFT flow-insertion, pattern generation, verification, and signoff-integrated into the broader RTL-to-GDSII methodology
  • Architect and implement test access for our multi-die package-post-package scan-chain access, known-good-die (KGD) sorting and screening, die-to-die (D2D) interconnect test, and a package-level test-access architecture designed in from the start rather than retrofitted
  • Implement DFT structures across the full range: scan (stuck-at, transition/at-speed), compression, boundary scan (JTAG/IEEE 1149.x), and IEEE 1500 core wrapping
  • Implement and verify Memory BIST, with particular emphasis on external MBIST controllers and shared/centralized BIST architectures serving distributed memory instances
  • Drive ATPG, fault simulation, coverage closure, and pattern conversion/porting to the ATE environment (STIL/WGL)
  • Perform DFT verification: scan chain integrity, pattern verification, and gate-level simulation (with SDF/timing) across all test modes
  • Help define and review DFT specifications, test access architecture, and test budgets (pin count, test time, coverage targets)
  • Support silicon bring-up, debug, diagnosis, and yield/failure analysis, correlating ATE results back to design
  • Collaborate with physical design on scan stitching, test point insertion, timing, and power-aware test (DFT interaction with power domains/UPF)
  • Document methodology and continuously automate and improve the flow
What we're looking for
  • BS/MS in Electrical Engineering, Computer Engineering, or related field.
  • 7+ years of hands-on DFT engineering on complex digital SoC/ASIC designs
  • Breadth across all of DFT - architecture, insertion, ATPG, BIST, boundary scan, verification, and silicon test - not just one sub-domain
  • DFT flow development - building, automating, and maintaining flows, not just running them
  • Hierarchical / core-wrapping DFT - hands-on architecting and implementing test at the core/block level
  • Multi-die / advanced-package DFT - post-package scan access, known-good-die (KGD) sorting, die-to-die interconnect test, and test-access architecture
  • Deep Siemens Tessent expertise - Scan & ATPG (TestKompress), MemoryBIST (incl. external/shared MBIST), BoundaryScan/IJTAG (SSN a plus)
  • Strong command of the fundamentals - scan insertion, ATPG (stuck-at/transition/path-delay), fault models, compression, JTAG/1149.x, IEEE 1500, scan-chain architecture, and coverage analysis
  • Gate-level simulation of test modes / DFT pattern verification; scripting for flow automation (Tcl, Python, Perl)
  • Familiarity with ATE pattern formats (STIL/WGL) and the design-to-tester handoff; solid RTL (Verilog/SystemVerilog) and SDC
  • Low-power DFT (UPF/CPF, power-aware ATPG, retention/isolation test) (preferred)


Compensation

Final offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
Visa Sponsorship

DensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export Controls

Aspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.

Full compensation packages are based on candidate experience and relevant certifications.

California pay range

$300,000-$350,000 USD

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