We are looking for a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development (NPD) team. In this role, you will enable the components that form the backbone of AWS network interconnect. You will perform high-quality design, development, validation, and sustaining engineering of IC and SOC packages for high-speed applications, working closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust solutions at scale. Key job responsibilities Packaging hardware development engineer (CHDE) perform high quality design, development, validation, deployment, and sustaining engineering of integrated circuit (IC) and system on chiop (SOC) packages for high-speed applications for AWS network. They work closely with design teams, manufacturing partners, and cross-functional stakeholders to deliver robust packaging and integated solutions.  Collaborate with vendors/manufacturers to evaluate new packaging technologies (IC and SOC), materials, and assembly processes. Create implementation plans for incorporating them into product roadmaps.  Develop and automate test plans for package characterization including signal integrity, power integrity, thermal performance, and mechanical reliability.  Collaborate with vendors/manufacturers in defining and developing test plans for IC/SOC packages, substrates, and interconnect technologies.  Work with operations teams in identifying quality issues, improving manufacturing yields, and optimizing RMA processes for packaged components. A day in the life On an everyday basis as part of our team, you have the unique opportunity to understand the growing AWS network and our internal customers' requirement on interconnect solutions and their components. You'll work backwards to devise hardware solutions by influencing the broad industry and/or to develop software tools with sister teams to maintain a highly available network that delights AWS customers. You design and implement processes and mechanisms that both help the team to deliver business impact to the organization in a systemic way, while also helping to raise the bar on our operational excellence. Operating at the scale we do, there is no blueprint for how to do what we do, which encourages our engineers to identify and develop simple solutions to complex problems. We encourage durable solutions that look around corners while taking into consideration our customer needs from a cost, performance, and reliability perspective. About the team Within AWS Networking the NPD (Network Product Development) organization is responsible for, designing the hardware, building the software, and owning the interconnects for the routers that power the global AWS network. Beyond product delivery we actively manage the fleet or routers in a network that grows by 70% annually. This means tracking key business and operational metrics to ensure that we operate smoothly and minimize or eliminate customer impact due to device related issues for a transparent AWS customer experience. BASIC QUALIFICATIONS - 1+ years of automation scripting using Python, Bash, Shell and/or Perl experience - Bachelor's degree or above in mechanical engineering, electrical engineering, materials science, or physics - 8+ years of work experience on IC/SOC packaging design, development, or validation - 8+ years of experience with high-speed signal integrity principles, transmission line theory, and package electrical modeling - 4+ years of experience developing test scripts and automation for package validation and characterization - 2+ years of experience working with IC/SOC packaging suppliers, substrate manufacturers, assembly houses, and qualification processes PREFERRED QUALIFICATIONS - Ph.D. in mechanical engineering, electrical engineering, material science, physics or equivalent - In depth expertise in IC/SOC package design including mechanical stress analysis, thermal management, and reliability engineering - Expertise in debugging and troubleshooting package-level failures and signal integrity issues - Experience working with OSAT (Outsourced Semiconductor Assembly and Test) and substrate suppliers - Experience in the semiconductor product development lifecycle - Ability to innovate or invent packaging solutions to meet performance, cost, and reliability requirements The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location. Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits. USA, CA, Cupertino - 183,000.00 - 247,600.00 USD annually