Job Details:Job Description:Yield Analysis and Defects Lead EngineerThe Advanced Packaging Technology and Manufacturing (APTM) Yield Group is seeking a Yield Analysis and Defects Lead Engineer to drive yield and defect improvement initiatives across Intel's advanced packaging technology portfolio.
In this role, you will lead efforts to identify, analyze, and resolve yield-limiting mechanisms throughout technology development and high-volume manufacturing (HVM). You will work with large-scale datasets, advanced analytics, inline metrology systems, and cross-functional engineering teams to improve manufacturing processes, test methodologies, and defect detection capabilities.
The successful candidate will establish team priorities, influence technical roadmaps, drive results across organizational boundaries, and ensure progress toward key yield milestones. This position offers the opportunity to become a technical expert in advanced packaging technologies while solving complex manufacturing and yield challenges.
Key Responsibilities- Extract insights from structured and unstructured datasets using statistical analysis, machine learning techniques, and data mining methodologies.
- Analyze large volumes of manufacturing, test, and defect data to identify yield-impacting trends and opportunities for improvement.
- Develop and implement solutions using manufacturing process knowledge, statistical methods, and structured problem-solving techniques.
- Drive recommendations and influence yield improvement roadmaps across technology development and manufacturing organizations.
- Analyze the relationship between electrical failures and physical defects through the application of:
- Failure Isolation and Failure Analysis (FIFA)
- Design for Test (DFT)
- Sort and Test methodologies
- Process Integration
- Manufacturing process flows
- Data mining and database analysis
- Data visualization techniques
- Evaluate inline defect metrology performance, detection capabilities, and defect monitoring systems used in manufacturing.
- Partner with Process Engineering, Integration, Quality and Reliability (Q&R), Product Engineering, and Test Development Engineering teams to resolve yield and defect challenges.
- Prepare and present detailed technical reports on yield performance, defect trends, and device health metrics.
- Define and drive corrective actions necessary to achieve world-class yield performance.
- Collaborate with upstream, downstream, and cross-functional stakeholders to support technology development, technology transfer, and successful ramp to high-volume manufacturing.
- Lead and mentor small teams of engineers in direct or indirect leadership capacities.
- Travel domestically and internationally as required.
Behavioral Skills- Ability to lead cross-functional teams and effectively influence stakeholders across organizational boundaries.
- Comfortable working in ambiguous environments and adapting to changing priorities.
- Strong teamwork, leadership, prioritization, and problem-solving capabilities.
- Excellent analytical thinking and passion for data-driven decision-making.
- Strong organizational skills and attention to detail.
- Effective interpersonal skills with the ability to collaborate across all organizational levels.
- Strong verbal, written, presentation, and technical communication skills.
- Positive attitude with a willingness to take ownership and lead initiatives.
- Ability to work independently with minimal supervision.
Qualifications:Minimum Qualifications- Bachelor's degree with 9+ years of experience, OR
- Master's degree with 6+ years of experience, OR
- PhD with 4+ years of experience
- In Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Computer Science, Information Systems, Physics, Chemistry, or a related technical discipline.
- 5+ years of experience performing data analysis using tools like JMP, Python, or similar statistical and data analysis tools.
Preferred Qualifications- Experience applying advanced statistical analysis techniques to manufacturing or yield-related problems.
- Experience utilizing structured technical problem-solving methodologies.
- Knowledge of semiconductor product design, circuit design, or architecture as it relates to yield analysis.
- Knowledge of inline defect metrology systems and their application to yield improvement.
- Experience with semiconductor manufacturing, advanced packaging technologies, or high-volume manufacturing environments.
- Experience working with large manufacturing datasets, databases, and data visualization tools.
- Experience leading technical projects or mentoring engineering teams.
Working ModelThis role may require domestic and international travel as needed to support technology development and manufacturing activities.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location:US, Oregon, Hillsboro
Additional Locations:US, New Mexico, Albuquerque
BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.
Annual Salary Range for jobs which could be performed in the US: $190,610.00-269,100.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
