Job Details:Job Description:The Role and ImpactIntel Foundry is seeking an exceptional Advanced Packaging Dry Etch Module Development Manager to lead our plasma etch technology development for next-generation packaging solutions. This role will drive the development and implementation of dry etch processes critical to Intel's industry-leading advanced packaging portfolio, including Foveros Direct, Foveros, and EMIB (Embedded Multi-die Interconnect Bridge) technologies. The successful candidate will manage a team of process engineers while maintaining deep technical involvement in plasma physics and etch system optimization. This position offers the opportunity to influence Intel's roadmap for technology leadership, manufacturing excellence, and enabling next-generation computing solutions.
Key Responsibilities- Lead and manage a team of engineers, providing clear goal setting, differentiated performance management, and coaching to foster a productive and innovative work environment
- Formulate long-term strategies for process roadmap to meet future requirements, ensuring Intel remains a leader in advanced packaging
- Oversee development of production-worthy etch processes for high-volume manufacturing
- Foster talent development for critical technical roles, and drive technical excellence and innovation within the etch team
- Develop and execute project schedules, track milestones and deliverables, and ensure timely feedback between cross-functional teams
- Drive dry etch module and segment related yield improvement initiatives and defect reduction programs
- Partner with process integration, manufacturing operations to achieve manufacturing excellence and ensure seamless technology transfer to high-volume manufacturing
The candidate should exhibit the following behavioral traits: - Excellent communication and collaboration skills to drive complex projects across diverse teams and stakeholders.
- Strategic mindset with a proven ability to solve complex technical challenges and implement process improvements to achieve business objectives.
Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates
Minimum Qualifications - Master or PhD degree in Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
- 10+ years of relevant experience with a master's degree, 8+ years or experience with a PhD degree.
The experience listed above should include a combination of the following qualifications:
- Plasma physics experience and hands-on experience working with various etch platform (ICP, CCP, RIE systems).
- Project management experience, including developing schedules, tracking deliverables, and managing cross-functional collaborations.
- Experience in the semiconductor industry.
Preferred Qualifications- Demonstrated ability to build and lead effective teams, including fostering an inclusive, productive, and innovative team culture.
- Experience with vendor relations, including material quality assessments and performance management.
- Strong knowledge of Design of Experiments (DOE) principles, problem-solving methodologies, and package interconnect technologies.
Job Type:Experienced Hire
Shift:Shift 1 (United States of America)
Primary Location:US, Oregon, Hillsboro
Additional Locations:Work Model for this RoleThis role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
