Advanced Micro Devices, Inc

Advanced Packaging Technologist

Advanced Micro Devices, Inc • $100K — $130K *
Austin, TX 78745In-Person
Consumer Technology
5 - 7 years of experience
Reposted Today
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Job Overview by Ladders

Qualifications

  • 5-7 years of relevant experience in PCB technologies and multi-physics modeling
  • Strong understanding of mechanical and thermal engineering principles
  • Experience with model-based architecture and design decisions
  • Proven ability to collaborate with cross-functional teams
  • Advanced degrees (MS or PhD) in engineering or physics

Responsibilities

  • Drive model-based architectural decisions for advanced PCB technologies
  • Develop and validate multi-physics models to inform package and board architecture
  • Optimize SMT and mechanical assembly processes in collaboration with manufacturing
  • Engage PCB suppliers and vendors to align with architectural needs
  • Define strategic direction for mechanical technology and assess readiness
  • Act as a subject-matter expert for PCB and board-level architectures

Benefits

  • Comprehensive medical, dental, and vision plans
  • Flexible working environment
  • Retirement savings plan with company match
  • Paid time off and holidays
  • Continuous learning and development opportunities
Full Job Description
THE ROLE:

In this role, you will serve as a PCB-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply mechanical and multi-physics models to guide package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

THE PERSON:

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for STCO-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

KEY RESPONSIBILITIES:
  • Drive model-based architecture and design decisions for development and qualification of advanced PCB technologies, including materials, stack-ups, high-layer-count designs, stiffness control and SMT & manufacturability considerations.
  • Develop and maintain mechanical and multi-physics models (structural, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
  • Partner with manufacturing and operations to define, optimize, and scale SMT and mechanical assembly processes, including component attach, solder joint reliability, assembly tolerances, yield, and connector strategies.
  • Engage with PCB suppliers, EMS partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
  • Define targets and strategic direction for mechanical and PCB technology development, assess technology readiness, and influence product roadmaps.
  • Serve as mechanical & multi-physics subject-matter expert for PCB and board-level architectures with a primary focus on data center platforms.


PREFERRED EXPERIENCE:
  • Demonstrated experience owning model-based architecture & design decisions, supported by board-, package-, and system-level mechanical and multi-physics modeling, characterization and validation.
  • Strong background in advanced PCB technologies, including materials, high-layer-count designs, warpage and stiffness control, and assembly constraints.
  • Solid foundation in Mechanics, Fracture, Materials, Design & FEA with the ability to apply first-principles understanding to multi-physics package-and-system-level design & assembly trade-offs.
  • Experience influencing SMT processes, connectors, and mechanical assembly strategies from an architecture and modeling perspective.
  • Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
  • Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.


ACADEMIC CREDENTIALS:

MS or PhD in relevant Engineering disciplines or physics.

LOCATION:

Austin, Texas

This role is not eligible for visa sponsorship

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Benefits offered are described: AMD benefits at a glance.

About Advanced Micro Devices, Inc

Advanced Micro Devices, Inc. Careers

Join the innovative forefront of technology with a career at Advanced Micro Devices, Inc. (AMD), a leader in semiconductor development. As part of our global team, you will contribute to an organization renowned for its dedication to innovation, leadership, and diversity in the tech industry.

Work You’ll Do

At AMD, we offer job opportunities that push the boundaries of what is possible. Our team is composed of professionals who lead the way in microprocessor and graphics technology, driving industry standards and innovation. With AMD, you will be part of a culture that values growth and professional development, ensuring that every team member has the opportunity to excel.

Transform Your Career

AMD is not just about advancing technology, but also about advancing careers. Whether you are looking for an internship, a full-time position, or leadership roles, AMD provides the platform to propel your career to new heights. Our commitment to professional growth is matched by our dedication to diversity and inclusion, making AMD a place where everyone can thrive.

Innovative Work Environment

Join a team of over 12,000 dedicated professionals at the intersection of technology, industry expertise, and digital innovation. At AMD, you will work on groundbreaking projects that shape the future of computing and graphics. Our collaborative environment encourages networking and the sharing of ideas across teams and disciplines.

Career Development and Benefits

AMD is committed to the development of its employees. We offer robust training programs, including leadership development and diversity training, to ensure our team is equipped for both current challenges and future opportunities. Our benefits package is designed to support the well-being and financial security of our employees and their families.

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Learn more about Advanced Micro Devices, Inc
Size
15,500 employees
Market Cap
$100.9 billion
Industry
Manufacturing & Automotive
Net Income
$2.4 billion
Founded
1969
5 Year Trend
+30.9%
Revenue
$9.7 billion
NASDAQ
AMD
* Ladders Estimates

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