ITAR Notice: This role involves access to ITAR-controlled information. Applicants must be U.S. persons (U.S. citizens, U.S. permanent residents, asylees, or refugees) per 22 CFR 120.62.
About the roleOwn different aspects of Packaging including Design Layout, SI/PI and Thermo-mechanical aspects. Work with chip-design and software teams driving DensityAI's AI accelerator program from first silicon through scale-out.
What you'll do- Own different aspects of Packaging including Design Layout, SI/PI and thermo-mechanical aspects
- Use and develop AI-assisted tool flows to accelerate package design and signoff timelines
What we're looking for- Exceptional abilities across the full advanced packaging design and tradeoffs
- 10+ years of experience on very high performance designs at advanced packaging like SIP, CoWoS, EMIB and other interposer technologies
- Hands-on with industry-standard packaging tools and flows for multi-die packaging (including 2.5D/3D)
- Demonstrated ability to work closely with architects to create right packaging solutions and sign off complex packaging solutions
- (Optional) DFT-aware packaging design, RTL and PD flows
CompensationFinal offers depend on level, location, and skills relevant to the role. Additional compensation: equity grant per company guidelines; medical / dental / vision; 401(k); standard PTO.
Visa SponsorshipDensityAI sponsors qualified candidates for H-1B, O-1, TN, E-3, and other employment-based visas, and we welcome applicants on F-1 OPT and STEM-OPT. Work authorization is required at start; we provide immigration support to secure or transfer status.
Export ControlsAspects of this role may involve access to information subject to U.S. export controls (EAR/ITAR). We may discuss licensing or scope adjustments during the interview.
Full compensation packages are based on candidate experience and relevant certifications.
California pay range
$200,000-$350,000 USD
