Champion innovative packaging solutions by leading new product introductions, collaborating across teams, and ensuring high-quality, cost-effective semiconductor assemblies. Drive technology advancements and manage product readiness for successful launches.

Lead our wireless engineering team to innovate and design robust firmware and systems. Collaborate across geographies to enhance product architecture, ensuring reliable communications and ultra-low latency audio transport.

Join a team that's shaping the future of wireless technology by developing innovative simulation tools and measurement methods for 3GPP standards. Collaborate across disciplines to influence RAN4 submissions and drive strategic initiatives in a dynamic environment.

Lead advanced failure analysis initiatives, ensuring robust root cause identification and driving corrective actions to enhance product reliability and quality across components, modules, and systems.