Drive the alignment of system specifications and manufacturing processes. Lead methodology and infrastructure efforts at scale, ensuring robust checks and automation to prevent discrepancies throughout the product lifecycle.

Shape the future of computing by overcoming silicon limits through innovative cross-domain solutions that redefine power, thermal, and packaging constraints, ensuring the next generation of high-performance products outpaces the competition.

Help us innovate high-speed memory systems by owning characterizations and qualifications across cutting-edge silicon platforms, transforming dataset insights into actionable solutions, and addressing complex multi-team memory failures.

Unlock the future of technology by redefining physical limits in silicon design. This role drives innovation across architecture, packaging, and manufacturing to ensure next-generation products exceed performance standards and competitiveness.

Lead the next generation of chip bring-up methodologies, coordinating cross-functional teams to enhance efficiency and execution from pre-silicon to product launch while driving continuous improvements for both processes and outcomes.