Develop and optimize deposition processes for next-gen DRAM, focusing on EUV patterns, while collaborating with cross-functional teams to achieve scalable solutions that meet cutting-edge technology demands.

Innovate and lead electrical failure analysis on SSDs, identifying root causes and managing critical RMA cases, while collaborating with cross-functional teams to enhance product reliability and performance.

Innovate in the semiconductor industry by developing and optimizing thin film deposition processes for next-gen DRAM technology. Collaborate with multi-functional teams to enhance manufacturing through cutting-edge material science.

Shape the future of semiconductor technology by developing innovative thin film processes crucial for next-gen DRAM. Collaborate with teams and partners to ensure scalability and performance in cutting-edge manufacturing environments.

Engage in the design, validation, and production of next-gen High Bandwidth Memory products. Collaborate across teams to ensure quality, implementing methodologies and solving complex technical challenges effectively through analysis and testing.