Transform product quality by joining a dynamic engineering team to resolve yield-limiting issues through analysis and innovative solutions, directly impacting both internal and external customer satisfaction and driving continuous improvement.

Unlock advanced DRAM technology by leading integration efforts for high-volume production, driving yield improvements, and collaborating with global teams in a cutting-edge manufacturing environment.

Innovate cutting-edge memory products by leading design and optimization of datapath circuits, focusing on TSV interface circuits for enhancing performance and power efficiency. Drive collaboration for architectural advancements and project execution.

Lead the charge in developing innovative digital circuits for memory products. Collaborate with cross-functional teams to optimize NAND circuit performance, ensuring quality and reliability in cutting-edge semiconductor applications.

Lead impactful initiatives in manufacturing and cleanroom projects, guiding multidisciplinary teams for flawless execution while ensuring compliance and innovative solutions that meet operational goals across diverse engineering disciplines.