Drive the development of advanced packaging materials strategies and lead a global team in executing innovative technologies for next-gen memory products, ensuring product alignment and supplier engagement across regions.

Accelerate progress at the forefront of semiconductor design by optimizing circuit layouts, conducting design verification, and ensuring high-quality manufacturing processes through collaboration with cross-functional teams.

Champion continuous improvement in New Product Introduction processes, collaborating cross-functionally to mitigate risks and enhance performance metrics. Drive operational excellence across manufacturing sites with a focus on semiconductor innovation.

Drive the development and validation of advanced integrated circuits, collaborating with engineering teams to enhance yield and performance through innovative design, testing, and analysis.

Lead the charge in defining DFT strategy and architecture for HBM designs, ensuring high-quality, manufacturable products while providing technical leadership across multiple teams and interfaces to drive standardization and process improvements.