Pioneer innovative embedded firmware development for cutting-edge DSP products, leading technical architecture and effective project coordination while collaborating with cross-functional teams to deliver exceptional solutions in the optical communication space.

Contribute to cutting-edge packaging solutions by leading design projects that meet stringent industry requirements. Collaborate with teams to ensure manufacturability and reliability while driving innovation in advanced technologies.

Shape the future of photonic chiplet development by leading end-to-end design and integration of high-speed electrical and optical technologies. Drive innovation in AI processing while mentoring a cross-functional team for optimal performance.

Join us to drive the development and validation of timing constraints for complex SoC designs. Collaborate cross-functionally and own STA signoff flows, ensuring optimal performance and energy efficiency in advanced technology nodes.

Create a cutting-edge Python framework for AI-integrated ASIC design verification, ensuring reproducibility and quality assurance while collaborating closely with DV engineers to deliver impactful solutions.