Advance your career by leveraging cutting-edge packaging technologies in AI architectures, collaborating across teams to enhance product designs and establish new standards in performance, power efficiency, and reliability in high-end computing.

Take ownership of advanced packaging technologies to innovate AI architectures. Collaborate across teams to enhance design processes, ensure reliability and scalability, and deliver cutting-edge solutions for high-performance computing systems.

Lead advanced characterization of semiconductor lasers and optical devices, ensuring robust testing methodologies and analyzing performance metrics. Collaborate cross-functionally to drive device development and mentor junior engineers.

Unlock breakthrough advancements in AI data centers by leading backend digital execution. Collaborate with top-tier experts to tackle innovative challenges, optimizing timing constraints and driving delivery of cutting-edge photonics solutions.

Join a team that's shaping the future of communication technologies. As a key architect, you'll define digital designs, engage with vendors, and drive innovation in groundbreaking AMS and photonic circuit architecture to enhance product capabilities.