Champion the advancement of AI packaging technologies through thermo-mechanical analysis, leading structural optimization for innovative photonics applications. Collaborate with teams to enhance product reliability, efficiency, and performance standards.

Engage in pioneering Machine Learning systems research, pushing boundaries with silicon photonics. Collaborate cross-functionally to optimize performance and create impactful designs, while leading a team to publish results that shape the industry.

Develop and validate firmware for next-gen photonic AI processors. Collaborate with cross-functional teams to ensure quality and reliability of embedded systems, optimizing software stacks and driving testing efforts for innovative products.

Advance cutting-edge packaging technologies by leading assembly process integration, collaborating with design teams and partners to ensure high-yield and reliability in advanced package designs for AI architectures and high-end computing solutions.

Innovate advanced board and system solutions to enhance machine learning and AI capabilities. Collaborate with cross-functional teams to validate and optimize high-speed interconnect circuits, ensuring performance meets industry standards.